公开(公告)号：US11627396B2

公开(公告)日：2023-04-11

申请号：US17658371

申请日：2022-04-07

Applicant: Google LLC

Inventor： Vivian W. Tang ,  Li Ya Wang ,  Yu-Ming Chen ,  Mihika Hemmady ,  DuanYing Lin ,  Yau-Shing Lee ,  Frédéric Heckmann

IPC: H04R1/02 ,  G06F3/16 ,  H04R1/34 ,  H04R9/02 ,  F21V33/00

Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.

公开(公告)号：US11363359B2

公开(公告)日：2022-06-14

申请号：US17001598

申请日：2020-08-24

Applicant: Google LLC

Inventor： Vivian W. Tang ,  Li Ya Wang ,  Yu-Ming Chen ,  Mihika Hemmady ,  DuanYing Lin ,  Yau-Shing Lee ,  Frédéric Heckmann

IPC: H04R1/02 ,  G06F3/16 ,  H04R1/34 ,  H04R9/02 ,  F21V33/00

Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.

公开(公告)号：US20220061128A1

公开(公告)日：2022-02-24

申请号：US17520545

申请日：2021-11-05

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H01Q5/307 ,  H05K1/02 ,  H05K7/14 ,  H05K7/20

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US20210100065A1

公开(公告)日：2021-04-01

申请号：US17001563

申请日：2020-08-24

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H05K1/02 ,  H05K7/20 ,  H05K7/14 ,  H01Q5/307

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US11744007B2

公开(公告)日：2023-08-29

申请号：US17520545

申请日：2021-11-05

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H05K1/02 ,  H05K7/14 ,  H05K7/20 ,  H01Q5/307 ,  H04W88/08 ,  H04W88/16

CPC classification number: H05K1/023 ,  H05K1/0203 ,  H05K7/1417 ,  H05K7/2039 ,  H01Q5/307 ,  H04W88/08 ,  H04W88/16 ,  H05K2201/10098 ,  H05K2201/10106

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US11202341B2

公开(公告)日：2021-12-14

申请号：US17001563

申请日：2020-08-24

Applicant: Google LLC

Inventor： Yau-Shing Lee ,  Rolando Willcox Esparza ,  George Liu ,  Wing Tung Wong ,  Frédéric Heckmann ,  Vivian W. Tang

IPC: H04W88/08 ,  H01Q5/307 ,  H05K1/02 ,  H05K7/14 ,  H05K7/20 ,  H04W88/16

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

公开(公告)号：US20180190285A1

公开(公告)日：2018-07-05

申请号：US15840844

申请日：2017-12-13

Applicant: GOOGLE LLC

Inventor： Frédéric Heckmann ,  Yau-Shing Lee ,  Robert Rose ,  Jun Hou ,  Patanjali Peri ,  Phanindraja Ancha

IPC: G10L15/22 ,  H05K7/20 ,  H04R1/34

CPC classification number: G10L15/22 ,  G06F1/20 ,  G10K11/26 ,  G10L2015/221 ,  H04M1/035 ,  H04M1/6033 ,  H04R1/345 ,  H04R9/022 ,  H04R27/00 ,  H04R2227/003 ,  H04R2227/005 ,  H04R2430/01 ,  H04R2499/11 ,  H05K1/02 ,  H05K7/20009

Abstract: This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.