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公开(公告)号：US12041401B2
公开(公告)日：2024-07-16
申请号：US18179757
申请日：2023-03-07
Applicant: Google LLC
Inventor： Vivian W. Tang , Li Ya Wang , Yu-Ming Chen , Mihika Hemmady , DuanYing Lin , Yau-Shing Lee , Frédéric Heckmann
CPC classification number: H04R1/025 , G06F3/167 , H04R1/345 , H04R9/022 , F21V33/0056
Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.
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公开(公告)号：US20190259385A1
公开(公告)日：2019-08-22
申请号：US16285061
申请日：2019-02-25
Applicant: GOOGLE LLC
Inventor： Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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公开(公告)号：US11942088B2
公开(公告)日：2024-03-26
申请号：US17230247
申请日：2021-04-14
Applicant: Google LLC
Inventor： Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Sastry Peri , Phanindraja Ancha
IPC: H04R1/34 , G06F1/20 , G10L15/22 , H04M1/03 , H04R9/02 , H05K7/20 , G10K11/26 , H04M1/60 , H04R27/00 , H05K1/02
CPC classification number: G10L15/22 , G06F1/20 , G06F1/203 , H04M1/035 , H04R1/345 , H04R9/022 , H05K7/20009 , G10K11/26 , G10L2015/221 , H04M1/6033 , H04R27/00 , H04R2227/003 , H04R2227/005 , H04R2430/01 , H04R2499/11 , H05K1/02
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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公开(公告)号：US20220232305A1
公开(公告)日：2022-07-21
申请号：US17658371
申请日：2022-04-07
Applicant: Google LLC
Inventor： Vivian W. Tang , Li Ya Wang , Yu-Ming Chen , Mihika Hemmady , DuanYing Lin , Yau-Shing Lee , Frédéric Heckmann
Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.
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公开(公告)号：US11011168B2
公开(公告)日：2021-05-18
申请号：US16285061
申请日：2019-02-25
Applicant: GOOGLE LLC
Inventor： Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
IPC: H04R1/02 , G10L15/22 , G06F1/20 , H04M1/03 , H04R1/34 , H04R9/02 , H05K7/20 , H04M1/60 , H04R27/00 , G10K11/26 , H05K1/02
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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Patent Agency Ranking
公开(公告)号：US20210099779A1
公开(公告)日：2021-04-01
申请号：US17001598
申请日：2020-08-24
Applicant: Google LLC
Inventor： Vivian W. Tang , Li Ya Wang , Yu-Ming Chen , Mihika Hemmady , DuanYing Lin , Yau-Shing Lee , Frédéric Heckmann
Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.
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公开(公告)号：US10290302B2
公开(公告)日：2019-05-14
申请号：US15840844
申请日：2017-12-13
Applicant: GOOGLE LLC
Inventor： Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
IPC: H04R1/34 , G10L15/22 , G06F1/20 , H04M1/03 , H04R9/02 , H05K7/20 , H04M1/60 , G10K11/26 , H05K1/02 , H04R27/00
Abstract: This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.
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公开(公告)号：US20230319979A1
公开(公告)日：2023-10-05
申请号：US18331627
申请日：2023-06-08
Applicant: Google LLC
Inventor： Yau-Shing Lee , Rolando Willcox Esparza , George Liu , Wing Tung Wong , Frédéric Heckmann , Vivian W. Tang
CPC classification number: H05K1/023 , H05K1/0203 , H05K7/1417 , H05K7/2039 , H01Q5/307
Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.
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公开(公告)号：US20230239604A1
公开(公告)日：2023-07-27
申请号：US18179757
申请日：2023-03-07
Applicant: Google LLC
Inventor： Vivian W. Tang , Li Ya Wang , Yu-Ming Chen , Mihika Hemmady , DuanYing Lin , Yau-Shing Lee , Frédéric Heckmann
CPC classification number: H04R1/025 , G06F3/167 , H04R1/345 , H04R9/022 , F21V33/0056
Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.
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公开(公告)号：US20210233531A1
公开(公告)日：2021-07-29
申请号：US17230247
申请日：2021-04-14
Applicant: Google LLC
Inventor： Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Sastry Peri , Phanindraja Ancha
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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