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公开(公告)号:US20180190285A1
公开(公告)日:2018-07-05
申请号:US15840844
申请日:2017-12-13
Applicant: GOOGLE LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
CPC classification number: G10L15/22 , G06F1/20 , G10K11/26 , G10L2015/221 , H04M1/035 , H04M1/6033 , H04R1/345 , H04R9/022 , H04R27/00 , H04R2227/003 , H04R2227/005 , H04R2430/01 , H04R2499/11 , H05K1/02 , H05K7/20009
Abstract: This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.
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公开(公告)号:US20190259385A1
公开(公告)日:2019-08-22
申请号:US16285061
申请日:2019-02-25
Applicant: GOOGLE LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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公开(公告)号:US11942088B2
公开(公告)日:2024-03-26
申请号:US17230247
申请日:2021-04-14
Applicant: Google LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Sastry Peri , Phanindraja Ancha
IPC: H04R1/34 , G06F1/20 , G10L15/22 , H04M1/03 , H04R9/02 , H05K7/20 , G10K11/26 , H04M1/60 , H04R27/00 , H05K1/02
CPC classification number: G10L15/22 , G06F1/20 , G06F1/203 , H04M1/035 , H04R1/345 , H04R9/022 , H05K7/20009 , G10K11/26 , G10L2015/221 , H04M1/6033 , H04R27/00 , H04R2227/003 , H04R2227/005 , H04R2430/01 , H04R2499/11 , H05K1/02
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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公开(公告)号:US11011168B2
公开(公告)日:2021-05-18
申请号:US16285061
申请日:2019-02-25
Applicant: GOOGLE LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
IPC: H04R1/02 , G10L15/22 , G06F1/20 , H04M1/03 , H04R1/34 , H04R9/02 , H05K7/20 , H04M1/60 , H04R27/00 , G10K11/26 , H05K1/02
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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公开(公告)号:US10290302B2
公开(公告)日:2019-05-14
申请号:US15840844
申请日:2017-12-13
Applicant: GOOGLE LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Peri , Phanindraja Ancha
IPC: H04R1/34 , G10L15/22 , G06F1/20 , H04M1/03 , H04R9/02 , H05K7/20 , H04M1/60 , G10K11/26 , H05K1/02 , H04R27/00
Abstract: This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.
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公开(公告)号:US20210233531A1
公开(公告)日:2021-07-29
申请号:US17230247
申请日:2021-04-14
Applicant: Google LLC
Inventor: Frédéric Heckmann , Yau-Shing Lee , Robert Rose , Jun Hou , Patanjali Sastry Peri , Phanindraja Ancha
Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.
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