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公开(公告)号:US20150192369A1
公开(公告)日:2015-07-09
申请号:US13764111
申请日:2013-02-11
Applicant: Google Inc.
Inventor: Felix Jose Alvarez Rivera , James Tanner , William Riis Hamburgen
IPC: F28D15/02
CPC classification number: G06F1/20 , F28D15/0233 , F28D15/0275 , G06F1/203 , H01L21/4882 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20336 , H05K7/20663 , H01L2924/00
Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.
Abstract translation: 在一个方面,提供了一种用于计算设备的冷却系统,例如膝上型计算机,蜂窝电话和平板计算机。 冷却系统包括通过具有中线的热管联接到散热器的散热器。 热管包括沿着中线纵向延伸的第一端部部分,沿着中线纵向延伸的第二端部部分和沿着中线部分纵向延伸的中间部分。 中间部分位于第一端部和第二端部之间,并且其厚度大于第一部分和第二部分的厚度,从而降低热管的总体热阻。
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公开(公告)号:US20130258585A1
公开(公告)日:2013-10-03
申请号:US13765817
申请日:2013-02-13
Applicant: Google Inc.
Inventor: James Tanner , William Riis Hamburgen
IPC: G06F1/20
CPC classification number: G06F1/203 , F28D1/024 , F28D15/0275 , F28F1/10 , F28F1/40 , F28F19/00 , G06F1/1656 , G06F1/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20136 , H05K7/20336 , H05K7/2039 , H01L2924/00
Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.
Abstract translation: 本公开的方面通常涉及主动冷却或移除由计算设备中的处理器产生的热量。 更具体地,计算装置中的冷却系统可以包括沿翅片组移动热量的热管。 翅片组件可以包括顶端和底端以及多个翅片。 翅片可仅在端部之间延伸一部分,从而形成空气管道。 空气管道可以允许碎屑沿着翅片的边缘移动并且离开计算装置。 翅片也可以是弯曲的,以促进碎屑通过翅片组的强迫,同时仍然允许热量通过翅片排出。
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