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    ACTIVE COOLING DEBRIS BYPASS FIN PACK
    1.
    发明申请
    ACTIVE COOLING DEBRIS BYPASS FIN PACK 有权
    主动冷却脱屑机

    公开(公告)号：US20170031396A1

    公开(公告)日：2017-02-02

    申请号：US15249908

    申请日：2016-08-29

    Applicant: Google Inc.

    Inventor： James Tanner ,  William Riis Hamburgen

    IPC: G06F1/20 ,  F28F19/00 ,  F28F1/40 ,  G06F1/16 ,  H05K7/20

    CPC classification number: G06F1/203 ,  F28D1/024 ,  F28D15/0275 ,  F28F1/10 ,  F28F1/40 ,  F28F19/00 ,  G06F1/1656 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20336 ,  H05K7/2039 ,  H01L2924/00

    Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

    Abstract translation: 本公开的方面通常涉及主动冷却或移除由计算设备中的处理器产生的热量。 更具体地，计算装置中的冷却系统可以包括沿翅片组移动热量的热管。 翅片组件可以包括顶端和底端以及多个翅片。 翅片可仅在端部之间延伸一部分，从而形成空气管道。 空气管道可以允许碎屑沿着翅片的边缘移动并且离开计算装置。 翅片也可以是弯曲的，以促进碎屑通过翅片组的强迫，同时仍然允许热量通过翅片排出。

    Active cooling debris bypass fin pack
    3.
    发明授权
    Active cooling debris bypass fin pack 有权
    主动散热片旁路散热片

    公开(公告)号：US08699226B2

    公开(公告)日：2014-04-15

    申请号：US13765817

    申请日：2013-02-13

    Applicant: Google Inc.

    Inventor： James Tanner ,  William Riis Hamburgen

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: G06F1/203 ,  F28D1/024 ,  F28D15/0275 ,  F28F1/10 ,  F28F1/40 ,  F28F19/00 ,  G06F1/1656 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20336 ,  H05K7/2039 ,  H01L2924/00

    Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

    Abstract translation: 本公开的方面通常涉及主动冷却或移除由计算设备中的处理器产生的热量。 更具体地，计算装置中的冷却系统可以包括沿翅片组移动热量的热管。 翅片组件可以包括顶端和底端以及多个翅片。 翅片可仅在端部之间延伸一部分，从而形成空气管道。 空气管道可以允许碎屑沿着翅片的边缘移动并且离开计算装置。 翅片也可以是弯曲的，以促进碎屑通过翅片组的强迫，同时仍然允许热量通过翅片排出。

    Vapor chamber with ring geometry
    4.
    发明授权
    Vapor chamber with ring geometry 有权

    公开(公告)号：US10073500B2

    公开(公告)日：2018-09-11

    申请号：US15284903

    申请日：2016-10-04

    Applicant: GOOGLE INC.

    Inventor： William Riis Hamburgen ,  Joshua Norman Lilje ,  James Cooper

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  G06F1/203 ,  H05K7/20336

    Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

    Variable thickness heat pipe
    5.
    发明授权
    Variable thickness heat pipe 有权
    可变厚度热管

    公开(公告)号：US09121645B2

    公开(公告)日：2015-09-01

    申请号：US13764111

    申请日：2013-02-11

    Applicant: Google Inc.

    Inventor： Felix Jose Alvarez Rivera ,  James Tanner ,  William Riis Hamburgen

    IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  F28D15/02

    CPC classification number: G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203 ,  H01L21/4882 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20336 ,  H05K7/20663 ,  H01L2924/00

    Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.

    Abstract translation: 在一个方面，提供了一种用于计算设备的冷却系统，例如膝上型计算机，蜂窝电话和平板计算机。 冷却系统包括通过具有中线的热管联接到散热器的散热器。 热管包括沿着中线纵向延伸的第一端部部分，沿着中线纵向延伸的第二端部部分和沿着中线部分纵向延伸的中间部分。 中间部分位于第一端部和第二端部之间，并且其厚度大于第一部分和第二部分的厚度，从而降低热管的总体热阻。

    ACTIVE COOLING DEBRIS BYPASS FIN PACK
    6.
    发明申请
    ACTIVE COOLING DEBRIS BYPASS FIN PACK 有权
    主动冷却脱屑机

    公开(公告)号：US20140198448A1

    公开(公告)日：2014-07-17

    申请号：US14191665

    申请日：2014-02-27

    Applicant: Google Inc.

    Inventor： James Tanner ,  William Riis Hamburgen

    IPC: G06F1/20 ,  F28F1/40

    CPC classification number: G06F1/203 ,  F28D1/024 ,  F28D15/0275 ,  F28F1/10 ,  F28F1/40 ,  F28F19/00 ,  G06F1/1656 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20336 ,  H05K7/2039 ,  H01L2924/00

    Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

    Abstract translation: 本公开的方面通常涉及主动冷却或移除由计算设备中的处理器产生的热量。 更具体地，计算装置中的冷却系统可以包括沿翅片组移动热量的热管。 翅片组件可以包括顶端和底端以及多个翅片。 翅片可仅在端部之间延伸一部分，从而形成空气管道。 空气管道可以允许碎屑沿着翅片的边缘移动并且离开计算装置。 翅片也可以是弯曲的，以促进碎屑通过翅片组的强迫，同时仍然允许热量通过翅片排出。

    MEMS-based display with high-strength cover glass
    9.
    发明授权
    MEMS-based display with high-strength cover glass 有权

    公开(公告)号：US09746664B1

    公开(公告)日：2017-08-29

    申请号：US14734886

    申请日：2015-06-09

    Applicant: GOOGLE INC.

    Inventor： William Riis Hamburgen ,  Ken Foo ,  Kevin Tom

    IPC: G02B26/04 ,  G06F3/041 ,  F21V8/00 ,  G02B1/14

    CPC classification number: G02B26/04 ,  G02B1/14 ,  G02B6/0068 ,  G02B26/02 ,  G06F3/041

    Abstract: An apparatus includes one or more light sources configured to provide light having at least three different colors and a backlight layer configured for diffusing the light. A MEMS-based shutter layer includes a plurality of pixel elements having shutters programmably controlled to allow light from the backlight layer to pass through the shutter layer when the MEMS-based shutter is in an open configuration and to block light from passing through the shutter layer when in a closed configuration. A processor is configured to control the provision of the different colored light from the one or more light sources to the backlight layer and configured to control the passage of light from the backlight layer through the plurality of pixel elements to provide a predetermined image on the display apparatus. A hard, scratch resistant cover glass layer is stacked above the MEMS-based shutter layer. The MEMS-based shutter layer is stacked above the backlight layer without any intermediate layer between it and the backlight layer, and the cover glass layer is stacked above the MEMS-based shutter layer without any intermediate layer between the shutter layer and the cover glass layer.

    Heat pipe cooling arrangement
    10.
    发明授权
    Heat pipe cooling arrangement 有权
    热管冷却装置

    公开(公告)号：US09405335B1

    公开(公告)日：2016-08-02

    申请号：US14186667

    申请日：2014-02-21

    Applicant: GOOGLE INC.

    Inventor： Joshua Boilard ,  Daniel Fourie ,  William Riis Hamburgen

    IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  B23P15/26

    CPC classification number: G06F1/20 ,  B23P15/26 ,  F28D15/0233 ,  F28D15/0275 ,  F28F21/02 ,  G06F1/203 ,  H01L23/373 ,  H01L23/427

    Abstract: A method of using a heat pipe to spot cool a component in a computer case involves disposing an evaporator portion of the heat pipe to be laterally or horizontally adjacent to, but not in direct contact with, the component in the computer case. The method further involves thermally coupling the laterally adjacent component and the evaporator portion of the heat pipe with a bridging heat transfer component.

    Abstract translation: 使用热管来点燃计算机机箱中的部件的方法包括将热管的蒸发器部分设置成横向或水平地与计算机机箱中的部件相邻但不直接接触。 该方法还包括用桥接传热部件热连接热管的横向相邻部件和蒸发器部分。

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