公开(公告)号：US20220272804A1

公开(公告)日：2022-08-25

申请号：US17181139

申请日：2021-02-22

Applicant: Google LLC

Inventor： Duen Hsing Hsieh ,  Ihab A. Ali

IPC: H05B45/18 ,  H05B45/14 ,  H05B45/00

Abstract: This document describes systems and techniques that use a virtual temperature-sensor for active thermal-control of a lighting system having an array of LEDs. The system and techniques use a forward voltage across the array of LEDs as the virtual temperature-sensor, converting the forward voltage to a level that is detectable by an MCU of the lighting system. In response to determining that the forward voltage exceeds a threshold, the lighting system may reduce an amount of an electrical current provided to the array of LEDs to decrease the forward voltage and alleviate a thermal condition that may be detrimental to the array of LEDs, thereby maintaining luminance capabilities of the array of LEDs and prolonging life of the array of LEDs.

公开(公告)号：US12176260B2

公开(公告)日：2024-12-24

申请号：US17979176

申请日：2022-11-02

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Emil Rahim ,  Truong Ho Cong

IPC: H05K7/20 ,  H01L23/367 ,  H04R1/02

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

公开(公告)号：US20240085011A1

公开(公告)日：2024-03-14

申请号：US18516220

申请日：2023-11-21

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: F21V29/70 ,  F21V23/02 ,  F21V29/87 ,  F21V33/00 ,  H05B45/18

CPC classification number: F21V29/70 ,  F21V23/02 ,  F21V29/87 ,  F21V33/0052 ,  H05B45/18 ,  F21Y2115/10

Abstract: This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

公开(公告)号：US20220110228A1

公开(公告)日：2022-04-07

申请号：US17061872

申请日：2020-10-02

Applicant: Google LLC

Inventor： Arun Prakash Raghupathy ,  Ihab A. Ali ,  Jacobi Colton Grillo

IPC: H05K7/20 ,  H04N7/18

Abstract: This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

公开(公告)号：US20220109222A1

公开(公告)日：2022-04-07

申请号：US17064372

申请日：2020-10-06

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H01Q1/02 ,  F28D20/02 ,  F28D15/02

Abstract: This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.

公开(公告)号：US20220104386A1

公开(公告)日：2022-03-31

申请号：US17035238

申请日：2020-09-28

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H05K7/20 ,  H05K9/00 ,  H01L23/373 ,  H01L23/552

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

公开(公告)号：US20220099606A1

公开(公告)日：2022-03-31

申请号：US17032679

申请日：2020-09-25

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/392 ,  G01R31/371

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US20220091484A1

公开(公告)日：2022-03-24

申请号：US17028456

申请日：2020-09-22

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Arun Prakash Raghupathy ,  Mark Benjamin Kraz ,  Kok Yen Cheng ,  Chi-Ming Lin

IPC: G03B17/55 ,  H04N7/18 ,  H04N5/225

Abstract: This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

公开(公告)号：US20220039285A1

公开(公告)日：2022-02-03

申请号：US16943929

申请日：2020-07-30

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: H05K7/20

Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

公开(公告)号：US20210410334A1

公开(公告)日：2021-12-30

申请号：US17407789

申请日：2021-08-20

Applicant: Google LLC

Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

IPC: H05K7/20 ,  H04R1/02

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits