公开(公告)号：US11761823B2

公开(公告)日：2023-09-19

申请号：US17006472

申请日：2020-08-28

Applicant: Google LLC

Inventor： Michael Mitchell ,  Arun Raghupathy ,  William Dong ,  Adrian Shanov

IPC: G01K1/16 ,  G01K13/024 ,  G05D23/19 ,  G01K13/02

CPC classification number: G01K1/16 ,  G01K13/02 ,  G05D23/1917 ,  G01K13/024

Abstract: A smart-home device may include a housing, a printed circuit board (PCB) inside the housing, an environmental sensor mounted to the PCB inside the housing, and a gasket that encloses the environmental sensor inside the housing to isolate the environmental sensor from an atmosphere inside of the housing while allowing an atmosphere outside of the housing to enter the gasket such that the environmental sensor can measure an aspect of the atmosphere outside of the housing.

公开(公告)号：US20210278030A1

公开(公告)日：2021-09-09

申请号：US17328501

申请日：2021-05-24

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US20200332947A1

公开(公告)日：2020-10-22

申请号：US16903049

申请日：2020-06-16

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US10683962B2

公开(公告)日：2020-06-16

申请号：US15607387

申请日：2017-05-26

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US20240357230A1

公开(公告)日：2024-10-24

申请号：US18758737

申请日：2024-06-28

Applicant: Google LLC

Inventor： Dietrich Ho ,  Aditya Ghadiali ,  Arun Raghupathy

IPC: H04N23/65 ,  H04N23/61 ,  H04N23/667

CPC classification number: H04N23/651 ,  H04N23/61 ,  H04N23/667

Abstract: A method including, at a camera, detecting motion in a field of view of the camera using a motion sensor, initiating processing of video data corresponding to the field of view in which the motion was detected, ceasing the processing after a first time duration, and determining a cool-off period for the motion sensor, the cool-off period having a second time duration based on the first time duration during which the camera does not detect motion using the motion sensor.

公开(公告)号：US11885838B2

公开(公告)日：2024-01-30

申请号：US17006780

申请日：2020-08-28

Applicant: Google LLC

Inventor： Daniel Adam Warren ,  Michael Mitchell ,  Gwendolyn van der Linden ,  Ford Rylander ,  Brian Silverstein ,  Arun Raghupathy

IPC: G01R22/06 ,  G01R22/10 ,  G05D23/19

CPC classification number: G01R22/065 ,  G01R22/10 ,  G05D23/1917

Abstract: A smart-home device may include a main power rail that provides power to components of the smart-home device; an integrator coupled to the main power rail that stores energy on an energy-storage device, where the energy stored on the energy-storage device is representative of an amount an amount of power provided to the smart-home device through the main power rail during an integration cycle of the integrator; and a counter that stores a number of integration cycles performed by the integrator during a time interval, where a total amount of power provided to the smart-home device through the main power rail during the time interval is represented by: (1) the number of integration cycles performed by the integrator during the time interval; and (2) the energy stored on the energy-storage device.

公开(公告)号：US20230304951A1

公开(公告)日：2023-09-28

申请号：US18312477

申请日：2023-05-04

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/371 ,  G01R31/392

CPC classification number: G01N25/72 ,  G01R31/371 ,  G01R31/392

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US11353158B2

公开(公告)日：2022-06-07

申请号：US17328501

申请日：2021-05-24

Applicant: Google LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

公开(公告)号：US20240353361A1

公开(公告)日：2024-10-24

申请号：US18758223

申请日：2024-06-28

Applicant: Google LLC

Inventor： David Wang ,  Arun Raghupathy ,  James Robert Lim ,  Ihab A. Ali ,  Chang Hong Ye

IPC: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

CPC classification number: G01N25/72 ,  G01R31/371 ,  G01R31/392 ,  H01M10/615 ,  H01M10/63

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

公开(公告)号：US11035517B2

公开(公告)日：2021-06-15

申请号：US16903049

申请日：2020-06-16

Applicant: GOOGLE LLC

Inventor： Arun Raghupathy ,  Benjamin Niewood ,  Cheng-Jung Lee ,  Adam Scott Kilgore

IPC: H04N5/225 ,  F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02 ,  F16M11/14 ,  G03B17/08 ,  G03B17/55 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.