Laser light source co-packaged with photonic integrated circuit and substrate

    公开(公告)号:US11564312B2

    公开(公告)日:2023-01-24

    申请号:US17034867

    申请日:2020-09-28

    Applicant: Google LLC

    Abstract: The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

    Optical equalization method for direct detection optical communication systems

    公开(公告)号:US10812196B2

    公开(公告)日:2020-10-20

    申请号:US16358200

    申请日:2019-03-19

    Applicant: Google LLC

    Abstract: Systems and methods of transmitting direct detection optical signal are provided. A direct detection optical transmitter according to illustrative embodiments includes a Mach Zehnder Modulator (MZM) configured to modulate laser light based on an electrical drive signal to generate a modulated optical signal and a complementary-modulated optical signal. The optical transmitter includes an optical finite impulse response (FIR) filter configured to receive the complementary-modulated optical signal and generate a filtered optical signal. The optical transmitter includes a polarization rotator configured to receive the filtered optical signal and output a rotated optical signal. The optical transmitter includes an optical combiner configured to combine the modulated optical signal and the rotated optical signal. The optical transmitter includes an output port configured to output the combined optical signal.

    DEVICE AND METHOD FOR COUPLING LASER TO A PHOTONIC INTEGRATED CIRCUIT

    公开(公告)号:US20200241222A1

    公开(公告)日:2020-07-30

    申请号:US16261211

    申请日:2019-01-29

    Applicant: Google LLC

    Abstract: A photonic integrated circuit for coupling a laser from an optical assembly to a grating coupler is disclosed. A method for coupling a laser to a photonic integrated circuit is disclosed. The optical assembly includes an optical system disposed on a v-groove bench. The optical system typically includes a laser source, a coupling lens or lens system, an optional isolator, a beam redirector that includes a prism or other light turning element and a cylindrical tube mounted on the v-groove bench. The method of tuning the angle of incidence from the optical assembly to the grating coupler is also disclosed.

    Mitigation Of Nonlinear Effects In Photonic Integrated Circuits

    公开(公告)号:US20220381975A1

    公开(公告)日:2022-12-01

    申请号:US17330512

    申请日:2021-05-26

    Applicant: Google LLC

    Abstract: A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.

    Integrated heater structures in a photonic integrated circuit for solder attachment applications

    公开(公告)号:US10895702B2

    公开(公告)日:2021-01-19

    申请号:US16371800

    申请日:2019-04-01

    Applicant: Google LLC

    Abstract: An apparatus including a photonic integrated circuit (PIC) coupled to an optical bench is disclosed. The PIC includes at least one grating coupler disposed thereon and the optical bench includes an optical system disposed thereon. The apparatus also includes an integrated heater at an upper surface of the PIC under the optical bench or at a bottom surface of the optical bench over the PIC. The apparatus also includes a layer of solder disposed between the PIC and the optical bench for coupling the bottom surface of the optical bench to the PIC. In some implementations, the layer of solder is in thermal communication with the integrated heater.

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