Support structures and interfaces
    14.
    发明授权

    公开(公告)号:US11491714B2

    公开(公告)日:2022-11-08

    申请号:US16607469

    申请日:2018-04-27

    Abstract: According to one example there is provided a non-transitory computer readable storage medium comprising instructions that, when executed by a processor, cause the processor to: obtain an object model; analyse the object model; obtain characteristics of an interface agent; generate a modified object model comprising a support structure and an interface between the support structure and the object, the interface being such that after generation of a 3D printed green part and after sintering thereof, the support structure may be released with a predetermined force; and controlling a 3D printer to generate a 3D printed green part based on the modified object model.

    SUPPORT STRUCTURES AND INTERFACES
    15.
    发明申请

    公开(公告)号:US20210331381A1

    公开(公告)日:2021-10-28

    申请号:US16607469

    申请日:2018-04-27

    Abstract: According to one example there is provided a non-transitory computer readable storage medium comprising instructions that, when executed by a processor, cause the processor to: obtain an object model; analyse the object model; obtain characteristics of an interface agent; generate a modified object model comprising a support structure and an interface between the support structure and the object, the interface being such that after generation of a 3D printed green part and after sintering thereof, the support structure may be released with a predetermined force; and controlling a 3D printer to generate a 3D printed green part based on the modified object model.

    Piezoelectric fluid ejection assembly

    公开(公告)号:US10112390B2

    公开(公告)日:2018-10-30

    申请号:US15822348

    申请日:2017-11-27

    Abstract: In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.

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