公开(公告)号：US09583432B2

公开(公告)日：2017-02-28

申请号：US14762799

申请日：2013-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kevin Dooley ,  Roger McQuaid ,  Liam Cheevers ,  David Fitzpatrick ,  Lorraine Byrne

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/532 ,  H01L21/768 ,  H01L23/528 ,  H01L27/12

CPC classification number: H01L23/5226 ,  H01L21/76802 ,  H01L21/76828 ,  H01L21/76877 ,  H01L23/528 ,  H01L23/5283 ,  H01L23/5329 ,  H01L27/1214 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer. An interconnect is in contact through the reflow via.

Abstract translation: 电介质层包括回流通孔。 回流通孔由电介质层的回流形成。 互连通过回流通孔接触。