公开(公告)号：US20140293531A1

公开(公告)日：2014-10-02

申请号：US13851750

申请日：2013-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robert J. Brooks ,  Scott Michael Fehringer

IPC: G06F1/16 ,  H05K3/00 ,  G06F1/20

CPC classification number: H05K3/00 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F2200/201 ,  H05K1/148 ,  H05K7/1487 ,  H05K2201/047 ,  H05K2201/10159 ,  Y10T29/4913

Abstract: According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an electrical component. A flexible printed circuit interconnect may communicatively interconnect the electrical component on the inner surface of the base module to the electrical component on the inner surface of the face module.

Abstract translation: 根据示例，服务器节点可以包括基本模块和可旋转地联接到基本模块以形成外壳的多个面模块。 多个面部模块的基座模块和面部模块可以各自包括包括电气部件的内表面。 柔性印刷电路互连可以将基座模块的内表面上的电气部件可通信地互连到面部模块的内表面上的电气部件。