公开(公告)号：US20190210362A1

公开(公告)日：2019-07-11

申请号：US16354588

申请日：2019-03-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stanley J. Wang ,  Terry McMahon ,  Mohammed S. Shaarawi ,  Donald W. Schulte

IPC: B41J2/045 ,  B41J2/21 ,  B41J2/165 ,  B41J2/14

CPC classification number: B41J2/04541 ,  B41J2/04508 ,  B41J2/0451 ,  B41J2/0455 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/16517 ,  B41J2/2139

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

公开(公告)号：US10272671B2

公开(公告)日：2019-04-30

申请号：US15747688

申请日：2015-10-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stanley J. Wang ,  Terry McMahon ,  Mohammed S. Shaarawi ,  Donald W. Schulte

IPC: B41J2/14 ,  B41J2/21 ,  B41J2/045 ,  B41J2/165

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

公开(公告)号：US11667128B2

公开(公告)日：2023-06-06

申请号：US17046877

申请日：2018-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Eric Martin ,  Terry McMahon ,  Donald W Schulte

IPC: B41J2/175 ,  H01L23/62 ,  H01L27/092 ,  H01L29/06 ,  H03K17/687

CPC classification number: B41J2/17566 ,  H01L23/62 ,  H01L27/092 ,  H01L29/0619 ,  B41J2002/17579 ,  H03K17/6871

Abstract: A fluidic die includes fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage. The fluidic die further includes monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including a connection structure and a select transistor and a pulldown transistor connected to the electrode via the connection structure. The connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.

公开(公告)号：US11214060B2

公开(公告)日：2022-01-04

申请号：US16605040

申请日：2017-12-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Donald W. Schulte ,  Donald J. Milligan ,  Terry McMahon

IPC: B41J2/14 ,  B41J2/175

Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

公开(公告)号：US20210170746A1

公开(公告)日：2021-06-10

申请号：US16760923

申请日：2018-01-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stan E. Leigh ,  Kellie Susanne Jensen ,  Terry McMahon ,  Donald W. Schulte

IPC: B41J2/14 ,  B41J2/175

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

公开(公告)号：US20210129543A1

公开(公告)日：2021-05-06

申请号：US16605040

申请日：2017-12-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Donald W. Schulte ,  Donald J. Milligan ,  Terry McMahon

IPC: B41J2/175 ,  B41J2/14

Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

公开(公告)号：US10675867B2

公开(公告)日：2020-06-09

申请号：US16354588

申请日：2019-03-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stanley J. Wang ,  Terry McMahon ,  Mohammed S. Shaarawi ,  Donald W. Schulte

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/165 ,  B41J2/21

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

公开(公告)号：US20170157925A1

公开(公告)日：2017-06-08

申请号：US15379562

申请日：2016-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Rio Rivas ,  Ed Friesen ,  Terry McMahon ,  Donald W. Schulte ,  David Douglas Hall

IPC: B41J2/14

CPC classification number: B05B15/60 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  Y10T29/49401

Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.

公开(公告)号：US11225070B2

公开(公告)日：2022-01-18

申请号：US16760923

申请日：2018-01-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stan E. Leigh ,  Kellie Susanne Jensen ,  Terry McMahon ,  Donald W. Schulte

IPC: B41J2/175 ,  B41J2/14 ,  B41J2/015 ,  B41J2/135

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

公开(公告)号：US10933634B2

公开(公告)日：2021-03-02

申请号：US16301132

申请日：2016-08-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Anthony M Fuller ,  Terry McMahon ,  Donald W Schulte ,  Amy Gault

IPC: B41J2/14 ,  B41J2/16 ,  G01N27/20

Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.