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公开(公告)号：US09368921B2
公开(公告)日：2016-06-14
申请号：US14630178
申请日：2015-02-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Adolfo Adolfo Gomez , Tom J. Searby
CPC classification number: H01R13/665 , H01R27/02 , H01R31/065
Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.
Abstract translation: 互连组件包括壳体，设置在壳体上的多个信号连接器，具有一个或多个总线元件的电力总线和组合连接器。 多个信号连接器包括第一信号连接器和第二信号连接器，并且每个信号连接器包括多个信号元件。 组合连接器设置在壳体上，并且包括多个连接元件，包括第一组连接元件，其在壳体内路由到第一信号连接器的多个信号元件;第二组连接元件，其在 壳体连接到第二信号连接器的多个信号元件，以及第三组连接元件，其在壳体内路由到电力总线的一个或多个总线元件。
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公开(公告)号：US20150171565A1
公开(公告)日：2015-06-18
申请号：US14630178
申请日：2015-02-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Adolfo Adolfo Gomez , Tom J. Searby
IPC: H01R13/66
CPC classification number: H01R13/665 , H01R27/02 , H01R31/065
Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.
Abstract translation: 互连组件包括壳体，设置在壳体上的多个信号连接器，具有一个或多个总线元件的电力总线和组合连接器。 多个信号连接器包括第一信号连接器和第二信号连接器，并且每个信号连接器包括多个信号元件。 组合连接器设置在壳体上，并且包括多个连接元件，包括第一组连接元件，其在壳体内路由到第一信号连接器的多个信号元件;第二组连接元件，其在 壳体连接到第二信号连接器的多个信号元件，以及第三组连接元件，其在壳体内路由到电力总线的一个或多个总线元件。
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公开(公告)号：US11331614B2
公开(公告)日：2022-05-17
申请号：US16484163
申请日：2017-02-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Ning Ge , Paul Howard Mazurkiewicz , Helen A. Holder , Peter A. Seiler , Raphael Gay , Tom J. Searby
Abstract: In an example, an air filter system includes an air filter and a thermally conductive particulate sensor (TCPS). The TCPS includes a temperature sensor to measure a first temperature of the TCPS at a first time, measure a second temperature of the TCPS at a second time, and provide the measured first temperature and the measured second temperature to a controller. The controller to determine an actual rate of temperature change based on the measured first temperature and the measured second temperature, compare the actual rate of temperature change to a target rate of temperature change, and provide a notification when a difference between the actual rate of temperature change and the target rate of temperature change is greater than an accumulation threshold indicative of a threshold amount of particulate accumulation on the TCPS.
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公开(公告)号：US10810152B2
公开(公告)日：2020-10-20
申请号：US16238722
申请日：2019-01-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Adolfo Gomez , Tom J. Searby , Omar Guadalupe Pena , Jonathan D. Bassett
Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
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公开(公告)号：US20200023301A1
公开(公告)日：2020-01-23
申请号：US16484163
申请日：2017-02-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Ning Ge , Paul Howard Mazurkiewicz , Helen A. Holder , Peter A. Seiler , Raphael Gay , Tom J. Searby
Abstract: In an example, an air filter system includes an air filter and a thermally conductive particulate sensor (TCPS). The TCPS includes a temperature sensor to measure a first temperature of the TCPS at a first time, measure a second temperature of the TCPS at a second time, and provide the measured first temperature and the measured second temperature to a controller. The controller to determine an actual rate of temperature change based on the measured first temperature and the measured second temperature, compare the actual rate of temperature change to a target rate of temperature change, and provide a notification when a difference between the actual rate of temperature change and the target rate of temperature change is greater than an accumulation threshold indicative of a threshold amount of particulate accumulation on the TCPS.
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Patent Agency Ranking
公开(公告)号：US10353442B2
公开(公告)日：2019-07-16
申请号：US15543205
申请日：2015-01-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Tom J. Searby
Abstract: An expansion slot interface may include a low-profile interface card to engage with an expansion slot, a linking device fixed to the interface card, and an expansion component connector to operably engage with an expansion component. The expansion component may be disposed apart from the interface card. The low-profile interface card may fit underneath a doublewide expansion component that is engaged with an adjacently disposed expansion slot, and the linking device may operably engage the interface card with the expansion component connector.
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公开(公告)号：US20160217097A1
公开(公告)日：2016-07-28
申请号：US14605909
申请日：2015-01-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Adolfo Gomez , Tom J. Searby , Omar Guadalupe Pena , Jonathan D. Bassett
IPC: G06F13/40
CPC classification number: G06F13/4068 , G06F1/187 , G11B33/128
Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
Abstract translation: 用于容纳多个存储设备的计算系统包括多个设备保持架和耦合到每个设备保持架的背板，以将多个存储设备电耦合到计算系统。 背板包括位于背板的第一侧上的多个设备组合信号和电源接口，以将多个存储设备耦合到背板。 背板还包括位于背板的第二侧上的多个组合信号和电源接口，以将背板耦合到计算系统。 背板还包括多个信号连接器以将背板耦合到计算系统。
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公开(公告)号：US20200333856A1
公开(公告)日：2020-10-22
申请号：US16756142
申请日：2017-11-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： David Quijano , Tom J. Searby , Adolfo A. Gomez
IPC: G06F1/18
Abstract: Examples herein relate to faceplates with filters. In some examples, an apparatus can include a faceplate, where the faceplate includes a plurality of perforations through a thickness of the faceplate, a filter attached to the faceplate, and a magnet to generate a magnetic attraction force between the faceplate and the filter such that the filter is magnetically attached to the faceplate.
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公开(公告)号：USD838717S1
公开(公告)日：2019-01-22
申请号：US29617118
申请日：2017-09-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer： David Quijano , Tom J. Searby , Jack Godfrey Wood , Harc Lee , Marcus Hoggarth
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公开(公告)号：US20170371382A1
公开(公告)日：2017-12-28
申请号：US15543205
申请日：2015-01-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Tom J. Searby
CPC classification number: G06F1/185 , G06F13/4068 , G06F13/4282 , G06F2213/0026
Abstract: An expansion slot interface may include a low-profile interface card to engage with an expansion slot, a linking device fixed to the interface card, and an expansion component connector to operably engage with an expansion component. The expansion component may be disposed apart from the interface card. The low-profile interface card may fit underneath a doublewide expansion component that is engaged with an adjacently disposed expansion slot, and the linking device may operably engage the interface card with the expansion component connector.
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