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公开(公告)号:USD888051S1
公开(公告)日:2020-06-23
申请号:US29646559
申请日:2018-05-04
Applicant: Hewlett-Packard Development Company, L.P.
Designer: David Quijano , Tom J. Searby , Jack Godfrey Wood , Harc Lee , Marcus Hoggarth
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公开(公告)号:US20200001306A1
公开(公告)日:2020-01-02
申请号:US16486134
申请日:2017-02-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Ning Ge , Paul Howard Mazurkiewicz , Helen A. Holder , Peter A. Seiler , Raphael Gay , Tom J. Searby
Abstract: In an example, an air filter assembly includes an air filter to remove particulates from air flowing through the air filter, sense electrodes coupled to the air filter, the sense electrodes spaced apart in a direction that is transverse to a direction of a flow of the air, a sense interconnects to couple the sense electrodes to a first power source to drive a sense electrode of the sense electrodes to a sense power, charge electrodes coupled to the air filter, where the charge electrodes are spaced apart from and adjacent to the sense electrodes, and charge interconnects to couple the charge electrodes to a second power source to drive a charge electrode of the charge electrodes to a charge power different from the sense power.
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公开(公告)号:US20180279462A1
公开(公告)日:2018-09-27
申请号:US15543206
申请日:2015-01-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Adolfo Gomez , Tom J. Searby , Andrew L. Wiltzius
Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.
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公开(公告)号:US10208980B2
公开(公告)日:2019-02-19
申请号:US15544661
申请日:2015-04-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Robert Lee Crane , Tom J. Searby , Andrew L. Wiltzius , Mark J. Wierbilis
Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.
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公开(公告)号:USD968385S1
公开(公告)日:2022-11-01
申请号:US29728765
申请日:2020-03-20
Applicant: Hewlett-Packard Development Company, L.P.
Designer: David Quijano , Tom J. Searby , Paul L. Drew
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公开(公告)号:US11432412B2
公开(公告)日:2022-08-30
申请号:US16077080
申请日:2017-07-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Robert P. Martin , Tom J. Searby , Ashton Ondra , Nathan B. Nuber , Kevin D. Kowalski , Derek Showers
Abstract: A sleeve for receiving a computing device includes airflow channels. One example sleeve may include a discrete GPU to be connected to the computing device and output signals to a display device.
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公开(公告)号:US20220113772A1
公开(公告)日:2022-04-14
申请号:US17068510
申请日:2020-10-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Tom J. Searby , Marcus Benzel
Abstract: In example implementations, a system board is provided. The system board includes a printed circuit board and an extended portion. The printed circuit board includes an electrical connection to a processor of a computing system. The extended portion is to redistribute power. The extended portion includes a connection to connect to a power supply unit and a plurality of power connections. The plurality of power connections are located along an edge of the extended portion to connect wiring to other components within the computing system and deliver power from the power supply unit to the other components.
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公开(公告)号:US10772186B2
公开(公告)日:2020-09-08
申请号:US15543206
申请日:2015-01-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Adolfo Gomez , Tom J. Searby , Andrew L. Wiltzius
IPC: H05K1/02 , H05K5/03 , H05K5/02 , B29C51/00 , B29C51/26 , B29C65/48 , B29C65/56 , B29K69/00 , B29L31/34
Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.
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公开(公告)号:US20190138482A1
公开(公告)日:2019-05-09
申请号:US16238722
申请日:2019-01-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Adolfo Gomez , Tom J. Searby , Omar Guadalupe Pena , Jonathan D. Bassett
CPC classification number: G06F13/4068 , G06F1/187 , G11B33/128
Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
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公开(公告)号:USD845295S1
公开(公告)日:2019-04-09
申请号:US29623563
申请日:2017-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Designer: David Quijano , Tom J. Searby , Jack Godfrey Wood , Harc Lee , Marcus Hoggarth
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