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    FILTER ASSEMBLY WITH CHARGE ELECTRODES
    2.
    发明申请
    FILTER ASSEMBLY WITH CHARGE ELECTRODES 审中-公开

    公开(公告)号：US20200001306A1

    公开(公告)日：2020-01-02

    申请号：US16486134

    申请日：2017-02-14

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Ning Ge ,  Paul Howard Mazurkiewicz ,  Helen A. Holder ,  Peter A. Seiler ,  Raphael Gay ,  Tom J. Searby

    IPC: B03C3/155 ,  B03C3/41 ,  B03C3/68 ,  B01D46/00

    Abstract: In an example, an air filter assembly includes an air filter to remove particulates from air flowing through the air filter, sense electrodes coupled to the air filter, the sense electrodes spaced apart in a direction that is transverse to a direction of a flow of the air, a sense interconnects to couple the sense electrodes to a first power source to drive a sense electrode of the sense electrodes to a sense power, charge electrodes coupled to the air filter, where the charge electrodes are spaced apart from and adjacent to the sense electrodes, and charge interconnects to couple the charge electrodes to a second power source to drive a charge electrode of the charge electrodes to a charge power different from the sense power.

    Shell ductings for cool air delivery
    4.
    发明授权
    Shell ductings for cool air delivery 有权

    公开(公告)号：US10208980B2

    公开(公告)日：2019-02-19

    申请号：US15544661

    申请日：2015-04-17

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Robert Lee Crane ,  Tom J. Searby ,  Andrew L. Wiltzius ,  Mark J. Wierbilis

    IPC: G06F1/20 ,  F24F13/02

    Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

    EXTENDED SYSTEM BOARDS FOR POWER DISTRIBUTION
    7.
    发明申请
    EXTENDED SYSTEM BOARDS FOR POWER DISTRIBUTION 有权

    公开(公告)号：US20220113772A1

    公开(公告)日：2022-04-14

    申请号：US17068510

    申请日：2020-10-12

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Tom J. Searby ,  Marcus Benzel

    IPC: G06F1/18 ,  H05K1/02

    Abstract: In example implementations, a system board is provided. The system board includes a printed circuit board and an extended portion. The printed circuit board includes an electrical connection to a processor of a computing system. The extended portion is to redistribute power. The extended portion includes a connection to connect to a power supply unit and a plurality of power connections. The plurality of power connections are located along an edge of the extended portion to connect wiring to other components within the computing system and deliver power from the power supply unit to the other components.

    STORAGE DEVICE CARRIER ASSEMBLY
    9.
    发明申请
    STORAGE DEVICE CARRIER ASSEMBLY 审中-公开

    公开(公告)号：US20190138482A1

    公开(公告)日：2019-05-09

    申请号：US16238722

    申请日：2019-01-03

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Adolfo Gomez ,  Tom J. Searby ,  Omar Guadalupe Pena ,  Jonathan D. Bassett

    IPC: G06F13/40 ,  G06F1/18

    CPC classification number: G06F13/4068 ,  G06F1/187 ,  G11B33/128

    Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.

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