MEASURING METHOD, DATA PROCESSING APPARATUS AND ELECTRON MICROSCOPE USING SAME
    12.
    发明申请
    MEASURING METHOD, DATA PROCESSING APPARATUS AND ELECTRON MICROSCOPE USING SAME 有权
    测量方法,数据处理设备和使用相同的电子显微镜

    公开(公告)号:US20140246585A1

    公开(公告)日:2014-09-04

    申请号:US14349375

    申请日:2012-09-27

    Abstract: The objective of the invention is to provide a measuring method that can determine pattern contours and dimensions with high precision even if an object to be measured shrinks due to electron beam radiations. In order to achieve this objective, a method, which performs measurements by irradiating an electron beam onto a sample having a pattern formed on a primary coating thereof, prepares an SEM image and contour of the pattern (S201, S202), material parameters of the pattern part and primary coating part of the sample (S203, S204), and a beam condition in irradiating the electron beam onto the sample (S205), and uses these prepared things to calculate a pattern shape or dimensions before the irradiation of the electron beam (S206).

    Abstract translation: 本发明的目的是提供一种能够以高精度确定图形轮廓和尺寸的测量方法,即使被测量物体由于电子束辐射而收缩。 为了实现该目的,通过将电子束照射到形成在其一次涂层上的图案的样品上进行测量的方法准备SEM图像和图案的轮廓(S201,S202),材料参数 样品的图案部分和初次涂布部分(S203,S204),以及将电子束照射到样品上的光束条件(S205),并且使用这些制备的物体来计算电子束照射之前的图案形状或尺寸 (S206)。

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