Integrated on-chip half-wave dipole antenna structure

    公开(公告)号:US06563464B2

    公开(公告)日:2003-05-13

    申请号:US09811940

    申请日:2001-03-19

    IPC分类号: H01Q138

    摘要: A semiconductor device is presented which is composed of two adjacent semiconductor chips. Each semiconductor chip has an integrated half-wave dipole antenna structure located thereon. The semiconductor chips are oriented so that the half-wave dipole antenna segments extend away from each other, allowing the segments to be effectively mated and thus form a complete full-wave dipole antenna. The two solder bumps which form the antenna are separated by a gap of approximately 200 microns. The length of each solder bump antenna is based on the wavelength and the medium of collection. Phased array antenna arrays may also be constructed from a plurality of these semiconductor chip antennae.

    Diaphragm activated micro-electromechanical switch
    12.
    发明授权
    Diaphragm activated micro-electromechanical switch 有权
    隔膜激活微机电开关

    公开(公告)号:US07256670B2

    公开(公告)日:2007-08-14

    申请号:US10523310

    申请日:2002-08-26

    IPC分类号: H01H51/22

    CPC分类号: H01H59/0009

    摘要: A micro-electromechanical (MEM) RF switch provided with a deflectable membrane (60) activates a switch contact or plunger (40). The membrane incorporates interdigitated metal electrodes (70) which cause a stress gradient in the membrane when activated by way of a DC electric field. The stress gradient results in a predictable bending or displacement of the membrane (60), and is used to mechanically displace the switch contact (30). An RF gap area (25) located within the cavity (250) is totally segregated from the gaps (71) between the interdigitated metal electrodes (70). The membrane is electrostatically displaced in two opposing directions, thereby aiding to activate and deactivate the switch. The micro-electromechanical switch includes: a cavity (250); at least one conductive path (20) integral to a first surface bordering the cavity; a flexible membrane (60) parallel to the first surface bordering the cavity (250), the flexible membrane (60) having a plurality of actuating electrodes (70); and a plunger (40) attached to the flexible membrane (60) in a direction away from the actuating electrodes (70), the plunger (40) having a conductive surface that makes electric contact with the conductive paths, opening and closing the switch.

    摘要翻译: 设置有可偏转膜(60)的微机电(MEM)RF开关激活开关触点或柱塞(40)。 膜包含交叉指向的金属电极(70),其通过DC电场激活时引起膜中的应力梯度。 应力梯度导致膜(60)的可预测的弯曲或位移,并且用于机械地移动开关触点(30)。 位于空腔(250)内的RF间隙区域(25)与交叉指向的金属电极(70)之间的间隙(71)完全分离。 膜在两个相反的方向上静电位移,从而有助于启动和停用开关。 微机电开关包括:空腔(250); 至少一个导电通路(20),与所述空腔相邻的第一表面成一体; 柔性膜(60),其平行于与所述腔(250)接壤的所述第一表面,所述柔性膜(60)具有多个致动电极(70); 以及沿远离所述致动电极(70)的方向附接到所述柔性膜(60)的柱塞(40),所述柱塞(40)具有导电表面,所述导电表面与所述导电路径电接触,所述开关闭合。

    Apparatus and method for forming a battery in an integrated circuit
    14.
    发明授权
    Apparatus and method for forming a battery in an integrated circuit 失效
    用于在集成电路中形成电池的装置和方法

    公开(公告)号:US06650000B2

    公开(公告)日:2003-11-18

    申请号:US09761123

    申请日:2001-01-16

    IPC分类号: H01L2900

    摘要: A method and structure that provides a battery within an integrated circuit for providing voltage to low-current electronic devices that exist within the integrated circuit. The method includes Front-End-Of-Line (FEOL) processing for generating a layer of electronic devices on a semiconductor wafer, followed by Back-End-Of-Line (BEOL) integration for wires connecting the electronic devices together to form completed electrical circuits of the integrated circuit. The BEOL integration includes forming a multilayered structure of wiring levels on the layer of electronic devices. Each wiring level includes conductive metallization (e.g., metal-plated vias, conductive wiring lines, etc.) embedded in insulative material. The battery is formed during BEOL integration within one or more wiring levels, and the conductive metallization conductively couples positive and negative terminals of the battery to the electronic devices. The battery may have several different topologies relative to the structural and geometrical relationships among the battery electrodes and electrolyte. Multiple batteries may be formed within one or more wiring levels, and may be conductively coupled to the electronic devices. The multiple batteries may be connected in series or in parallel.

    摘要翻译: 在集成电路内提供电池的方法和结构,用于向存在于集成电路内的低电流电子器件提供电压。 该方法包括用于在半导体晶片上产生电子器件层的前端在线(FEOL)处理,随后是用于将电子器件连接在一起的线的后端(BEOL)集成,以形成完整的电 集成电路的电路。 BEOL集成包括在电子设备层上形成布线层的多层结构。 每个布线层包括嵌入在绝缘材料中的导电金属化(例如,金属镀通孔,导电布线等)。 电池在BEOL集成期间在一个或多个布线层次内形成,并且导电金属化将电池的正端子和负极端子电连接到电子设备。 相对于电池电极和电解质之间的结构和几何关系,电池可能具有几种不同的拓扑结构。 多个电池可以形成在一个或多个布线层中,并且可以导电地耦合到电子设备。 多个电池可以串联或并联连接。