摘要:
In one embodiment, a self-aligned contact (SAC) trench structure is formed through a dielectric layer to expose an active region of a MOS transistor. The SAC trench structure not only exposes the active region for electrical connection but also removes portions of a stress liner over the active region. This leaves the stress liner mostly on the sidewall and top of the gate of the MOS transistor. Removing portions of the stress liner over the active region substantially removes the lateral component of the strain imparted by the stress liner on the substrate, allowing for improved drive current without substantially degrading a complementary MOS transistor.
摘要:
A nonvolatile charge trap memory device is described. The device includes a substrate having a channel region and a pair of source and drain regions. A gate stack is above the substrate over the channel region and between the pair of source and drain regions. The gate stack includes a high dielectric constant blocking region.
摘要:
Non-volatile semiconductor memories and methods of fabricating the same to improve performance thereof are provided. In one embodiment, the method includes: (i) forming a gate for a non-volatile memory transistor on a surface of a substrate overlaying a channel region formed therein, the gate including a charge trapping layer; and (ii) forming a strain inducing structure over the gate of the non-volatile memory transistor to increase charge retention of the charge trapping layer. Preferably, the memory transistor is a silicon-oxide-nitride-oxide-silicon (SONOS) transistor comprising a SONOS gate stack. More preferably, the memory also includes a logic transistor on the substrate, and the step of forming a strain inducing structure comprises the step of forming the strain inducing structure over the logic transistor. Other embodiments are also disclosed.
摘要:
A semiconductor device and method of fabricating the same are provided. In one embodiment, the semiconductor device includes a memory transistor with an oxide-nitride-nitride-oxide (ONNO) stack disposed above a channel region. The ONNO stack comprises a tunnel dielectric layer disposed above the channel region, a multi-layer charge-trapping region disposed above the tunnel dielectric layer, and a blocking dielectric layer disposed above the multi-layer charge-trapping region. The multi-layer charge-trapping region includes a substantially trap-free layer comprising an oxygen-rich nitride and a trap-dense layer disposed above the trap-free layer. The semiconductor device further includes a strain inducing structure including a strain inducing layer disposed proximal to the ONNO stack to increase charge retention of the multi-layer charge-trapping region. Other embodiments are also disclosed.
摘要:
In one embodiment, a device includes a form factor of a stylus. The form factor includes a surface area. The device also includes one or more substrates disposed along one or more portions of the surface area; and one or more touch sensors disposed on one or more of the substrates. At least one of the touch sensors includes a distinct touch-sensitive area that includes a touch-sensitive button, a touch-sensitive wheel, or a touch-sensitive slider. The device also includes a computer-readable non-transitory storage medium coupled to one or more of the touch sensors and embodying logic configured to associate the distinct touch-sensitive area with a pre-determined function of the device.
摘要:
In one embodiment, a stylus with one or more electrodes and one or more computer-readable non-transitory storage media embodying logic for transmitting signals wirelessly to a device through a touch sensor of the device has one or more sensors for detecting movement of the stylus.
摘要:
In one embodiment, an integrated circuit includes a PMOS transistor having a gate stack comprising a P+ doped gate polysilicon layer and a nitrided gate oxide (NGOX) layer. The NGOX layer may be over a silicon substrate. The integrated circuit further includes an interconnect line formed over the transistor. The interconnect line includes a hydrogen getter material and may comprise a single material or stack of materials. The interconnect line advantageously getters hydrogen (e.g., H2 or H2O) that would otherwise be trapped in the NGOX layer/silicon substrate interface, thereby improving the negative bias temperature instability (NBTI) lifetime of the transistor.
摘要:
In one embodiment, a device includes a form factor of a stylus. The form factor includes a surface area. The device also includes one or more substrates disposed along one or more portions of the surface area; and one or more touch sensors disposed on one or more of the substrates. At least one of the touch sensors includes a distinct touch-sensitive area that includes a touch-sensitive button, a touch-sensitive wheel, or a touch-sensitive slider. The device also includes a computer-readable non-transitory storage medium coupled to one or more of the touch sensors and embodying logic configured to associate the distinct touch-sensitive area with a pre-determined function of the device.
摘要:
One embodiment in accordance with the invention can include a capacitive touch screen. The capacitive touch screen includes a substantially transparent substrate and a plurality of electrodes formed on the substantially transparent substrate. The plurality of electrodes are substantially parallel in a first direction and each of the plurality of electrodes includes a layer of light altering material.
摘要:
A gate structure for a MOSFET device comprises a gate insulation layer, a first layer of a first metal abutting the gate insulation layer, and a second layer overlying the first layer and comprising a mixture of the metal of the first layer and a second metal, the metal layers formed by the diffusion of the first metal into and through the second metal. The second metal can be used as the gate for a n-MOS transistor, and the mixture of first metal and second metal overlying a layer of the first metal can be used as a gate for a p-MOS transistor where the first metal has a work function of about 5.2 eV and the second metal has a work function of about 4.1 eV.