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公开(公告)号：US12105330B2
公开(公告)日：2024-10-01
申请号：US16948726
申请日：2020-09-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Kevin Leigh , Everett Salinas , John Franz
CPC classification number: G02B6/3897 , G02B6/4452 , G02B6/4453 , H01R12/7005 , H05K7/1454 , H05K7/1492
Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
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公开(公告)号：US20240251528A1
公开(公告)日：2024-07-25
申请号：US18627195
申请日：2024-04-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina , Harvey J. Lunsman , Tahir Cader , John Franz
CPC classification number: H05K7/20509 , G06F1/20 , H05K1/0203
Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
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公开(公告)号：US11937407B2
公开(公告)日：2024-03-19
申请号：US17278514
申请日：2019-02-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey Lunsman
CPC classification number: H05K7/20781 , H05K5/04 , H05K7/20272
Abstract: An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.
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公开(公告)号：US11877422B2
公开(公告)日：2024-01-16
申请号：US17399940
申请日：2021-08-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Ernesto Ferrer , Tahir Cader
CPC classification number: H05K7/20272 , F28F9/0224 , F28F9/0248 , H05K1/0203 , H05K7/20218 , H05K7/20254 , H05K2201/10159
Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.
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公开(公告)号：US11729943B2
公开(公告)日：2023-08-15
申请号：US17155304
申请日：2021-01-22
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer , John Franz
IPC: H05K7/20
CPC classification number: H05K7/20254 , H05K7/20336
Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.
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Patent Agency Ranking
公开(公告)号：US11729934B2
公开(公告)日：2023-08-15
申请号：US17249449
申请日：2021-03-02
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Michael Hanson
IPC: H05K7/14
CPC classification number: H05K7/1401 , H05K7/1488
Abstract: Examples described herein relate to a securing sub-system. The securing sub-system includes a lever and a cam assembly engaged with the lever. The cam assembly is movable due to a pivotal movement of the lever and includes a cam body, a cantilevered arm, and a load support member. The cantilevered arm extends from the cam body and is deformable when the cantilevered arm contacts a restrictive structure. The load support member disposed on the insertion cam. A portion of the load support member is offset from an open end of the cantilevered arm to limit deformation of the cantilevered arm. Further, some examples described herein relate to a securing system including a plurality of securing sub-systems coupled via a synchronous movement link is also presented. Moreover, certain examples described herein relate to a computing system including at least one such securing sub-system.
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公开(公告)号：US20230047496A1
公开(公告)日：2023-02-16
申请号：US17399940
申请日：2021-08-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
Inventor： John Franz , Ernesto Ferrer , Tahir Cader
Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.
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公开(公告)号：US11417451B2
公开(公告)日：2022-08-16
申请号：US17073022
申请日：2020-10-16
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey J. Lunsman , Everett Salinas
Abstract: Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.
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公开(公告)号：US20220122751A1
公开(公告)日：2022-04-21
申请号：US17073022
申请日：2020-10-16
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey J. Lunsman , Everett Salinas
Abstract: Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.
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公开(公告)号：US11199192B1
公开(公告)日：2021-12-14
申请号：US16943069
申请日：2020-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Tahir Cader , Ernesto Ferrer Medina
Abstract: Example implementations relate to a method and system for pumping fluid with a pump assembly to cool waste-heat producing system of an apparatus. The pump assembly includes a first housing, a rotor assembly, a stator assembly, a second housing, an outlet connection port coupled to the second housing, and a guide vane insert. The first housing includes a first bore and first inlet guide vanes (IGVs) coupled to inlet of the first bore. The rotor assembly including an impeller, is disposed in the first bore. The stator assembly including a coil, is mounted around a portion of the first housing. The second housing has a second bore fluidically coupled to the first bore, and first outlet guide vanes (OGVs) coupled at an entrance of the second bore. The guide vane insert including second OGVs, is disposed within the outlet connection port and fluidically coupled to outlet of the second bore.
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