Abstract:
The present invention provides a structure in which the coil center of a first coil layer is formed on a planarized surface, a first contact portion is formed by plating on the coil center, and the coil center of a second coil layer is conductively connected to the upper surface of the first contact portion. This structure can exhibit a stable DC resistance value and good conductivity.
Abstract:
A thin-film magnetic head includes a lower core layer, a gap layer formed on the lower core layer with a lower pole layer therebetween, an upper pole layer formed on the gap layer, an upper core layer formed on the upper pole layer, and a Gd-defining layer for defining the depth in the height direction of the joint surface between the gap layer and the upper pole layer. The width in the track width direction of the gap layer is smaller than or equal to the width in the track width direction of the upper pole layer when viewed from the surface facing the recording medium. By employing such a thin-film magnetic head, the width in the track width direction of the gap layer can be decreased, and thus track narrowing is achieved.
Abstract:
A track width regulating section having a track width, which is smaller than the resolution obtained by the wavelength of the light used for exposure and development of a resist, is formed between a lower core layer and an upper core layer. Since the width of the upper core layer is larger than the track width, magnetic saturation can be effectively reduced. Inclined faces are formed on the upper surface of the lower core layer so as to be inclined in directions away from the track width regulating section, thereby adequately preventing write fringing.
Abstract:
A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.
Abstract:
A thin film magnetic head with a metal lamination part and method of manufacturing the same are provided. The thin film magnetic head including a metal lamination part in which an upper metal layer is laminated on a lower metal layer. The metal lamination part is formed in the laminated structure. An interlayer connection surface between the lower metal layer and the upper metal layer of the metal lamination part is formed in a concave shape that is curved toward the lower metal layer.
Abstract:
A thin film magnetic head with a metal lamination part and method of manufacturing the same are provided. The thin film magnetic head including a metal lamination part in which an upper metal layer is laminated on a lower metal layer. The metal lamination part is formed in the laminated structure. An interlayer connection surface between the lower metal layer and the upper metal layer of the metal lamination part is formed in a concave shape that is curved toward the lower metal layer.
Abstract:
In a thin film magnetic head, a face surface faces a recording medium and a front surface of an upper core layer is a curved surface which gradually retreats in a height direction generally perpendicular to the face surface as it approaches both sides thereof, and the thickness of the upper core layer gradually increases in the height direction. It is thus possible to appropriately suppress the occurrence of side fringing, efficiently cause a magnetic flux to flow from the upper core layer to an upper pole layer, and make the thin film magnetic head adaptable to a higher recording density.
Abstract:
A thin-film magnetic head includes a first coil layer disposed at a lower core layer side of the interface between an upper core layer and an upper magnetic-pole layer, which are joined to each other, and a second coil layer disposed at the upper core layer side of the interface between the upper core layer and the upper magnetic-pole layer. The thickness of a coil conductor of the first coil layer is set smaller than the thickness of a coil conductor of the second coil layer.
Abstract:
A track width regulating section having a track width, which is smaller than the resolution obtained by the wavelength of the light used for exposure and development of a resist, is formed between a lower core layer and an upper core layer. Since the width of the upper core layer is larger than the track width, magnetic saturation can be effectively reduced. Inclined faces are formed on the upper surface of the lower core layer so as to be inclined in directions away from the track width regulating section, thereby adequately preventing write fringing.
Abstract:
In a magnetic detection device using a magnetic resistance element, the resistance of a layer having a multi-layer structure can be easily adjusted without causing damages to the layer. A magneto-resistance layer is connected in series to a reference resistance layer, and a magneto-resistance layer is connected in series to a reference resistance layer on a substrate. A voltage is applied between a power supply layer and a grounding layer. A first output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. A second output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. Accordingly, it is possible to adjust the resistance of the reference resistance layers by selecting the respective positions of the connection layers.