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公开(公告)号：US20070044718A1
公开(公告)日：2007-03-01
申请号：US11551726
申请日：2006-10-23
CPC分类号： H01L21/68757 , H01L21/67103 , H01L21/67248
摘要： A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).
摘要翻译： 提供了一种晶片保持器，其中支撑和加热晶片中的局部热辐射保持在控制之下，并且晶片保持表面的温度均匀性得到增强，并且通过利用晶片保持器，适于处理较大直径晶片的半导体制造装置为 提供。 在陶瓷基板（2）内具有电阻加热元件（3）等并配有穿过反应室（6）的引线（4）的晶片保持器（1）中，引线（4）容纳在 管状引导构件（5）以及引导构件（5）和反应室（6）之间的间隔以及引导构件（5）的内部被气密地密封。 引导构件（5）和陶瓷基板（2）不接合在一起，并且在内部被密封的引导构件（5）的内部，朝向陶瓷基板（2）的气氛优选为 与反应室（6）中的气氛相同。
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公开(公告)号：US20050166848A1
公开(公告)日：2005-08-04
申请号：US10503784
申请日：2003-09-26
CPC分类号： H01L21/68792 , H01L21/67103 , H05B3/143
摘要： A wafer holder furnished with a plurality of anchored tubular pieces and/or anchored support pieces affixed to the holder's ceramic susceptor and in which damage to the anchored tubular pieces due to thermal stress during heating operations is prevented, and a high-reliability semiconductor manufacturing apparatus utilizing the wafer holder are made available. One end of at least two of the anchored tubular pieces (5) and/or anchored support pieces is affixed to the ceramic susceptor (2) and the other end is fixed in the reaction chamber (4), wherein letting the highest temperature the ceramic susceptor (2) attains be T1, the thermal expansion coefficient of the ceramic susceptor (2) be α1, the highest temperature the reaction chamber (4) attains be T2, the thermal expansion coefficient of the reaction chamber (4) be α2, the longest inter-piece distance on the ceramic susceptor (2) among the plurality of anchored tubular pieces (5) and/or anchored support pieces at normal temperature be L1, and the longest inter-piece distance on the reaction chamber (4) among the plurality of anchored tubular pieces (5) and/or anchored support pieces at normal temperature be L2, then the relational formula |(T1×α1×L1)−(T2×α2×L2)|≦0.7 mm is satisfied.
摘要翻译： 一种晶片保持器，其配备有多个固定在保持器的陶瓷基座上的锚固的管状件和/或锚定的支撑件，并且其中由于加热操作期间的热应力而损坏锚定的管状件，并且高可靠性的半导体制造装置 使用晶片保持器可用。 至少两个锚固的管状件（5）和/或锚固的支撑件的一端固定在陶瓷基座（2）上，另一端固定在反应室（4）中，其中使最高温度的陶瓷 基座（2）达到T1，陶瓷基座（2）的热膨胀系数为α1，反应室（4）达到最高温度为T2，反应室（4）的热膨胀系数为α2， 多个锚定管状件（5）中的陶瓷基座（2）和常规温度下的固定支撑件之间的最长间隔距离为L1，反应室（4）中最长的间隔距离为 在常温下多个锚定的管状件（5）和/或锚定的支撑件为L2，则满足关系式|（T1xalpha1xL1） - （T2xalpha2xL2）| <= 0.7mm。
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公开(公告)号：US08446724B2
公开(公告)日：2013-05-21
申请号：US12452612
申请日：2008-07-25
申请人： Tatsuya Shimizu , Manabu Hashikura
发明人： Tatsuya Shimizu , Manabu Hashikura
IPC分类号： H05K7/20
CPC分类号： H02G3/03 , H05K7/20127 , H05K7/202
摘要： In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.
摘要翻译： 在电连接箱中，隔热壁在壳体中垂直延伸。 这形成在隔热壁和壳体的内壁之间，空气可以上升的上升流路和空气可以下降的下降流路。 在隔热壁的上端和下端分别设置有连通上升流路和下降流路的上连通开口和下连通开口。 继电器放置在上升流路中。 在这种情况的区域中，形成下降流路的区域设置有用于将下降流路中的空气的热量释放到壳体的外部的散热壁部。
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公开(公告)号：US07666006B2
公开(公告)日：2010-02-23
申请号：US12314370
申请日：2008-12-09
申请人： Manabu Hashikura , Tatsuya Sumida
发明人： Manabu Hashikura , Tatsuya Sumida
IPC分类号： H01R12/00
CPC分类号： H05K7/026
摘要： An electric connection box includes an electronic circuit board having an electronic component, and a power circuit board having a power circuit, which are disposed upright in a casing. A vertically-extending component area for mounting a heat generating component is formed on the power circuit board, so as not to face the electronic circuit board. A partition wall for separating the component area from the electronic circuit board is provided in the casing, and thereby a first air passage for allowing air to flow vertically along the component area is formed in the casing. A first inlet port connected to the first air passage is formed on the casing, and a first outlet port connected to the first air passage and positioned above the first inlet port is formed on the casing.
摘要翻译： 电连接盒包括具有电子部件的电子电路板和具有电源电路的电源电路板，其直接设置在壳体中。 在电源电路板上形成用于安装发热部件的垂直延伸的部件区域，以便不面对电子电路板。 在壳体中设置有用于将电子电路板分离的分隔壁，从而在壳体内形成有用于使空气沿着部件区域垂直流动的第一空气通路。 连接到第一空气通道的第一入口端口形成在壳体上，并且连接到第一空气通道并位于第一入口上方的第一出口形成在壳体上。
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公开(公告)号：US20080119068A1
公开(公告)日：2008-05-22
申请号：US11984086
申请日：2007-11-13
IPC分类号： H05K1/02
CPC分类号： H05K7/20009 , H05K5/0208 , H05K7/026
摘要： One aspect of the present invention can include an electric connection box having a circuit board, a case inside of which said circuit board is housed, a plurality of fitting depressions capable of being fitted with an external electrical component, positioned on a side wall of the case opposing a board surface of the circuit board. Further, an air path inside of said case is defined by the plurality of fitting depressions positioned as an arrayed side by side with a spacing in between, and the air path circulates the air up and down between the plurality of fitting depressions, and an inlet positioned in the case and in communication with the air path, an exhaust outlet is positioned in the case in communication with the air path and positioned above said inlet, and a heat generating component is positioned in the air path.
摘要翻译： 本发明的一个方面可以包括具有电路板的电连接盒，容纳所述电路板的壳体内的多个嵌合凹部，其能够装配有外部电气部件，位于所述电路板的侧壁上 壳体与电路板的板表面相对。 此外，所述壳体内部的空气通道由多个嵌合凹部限定，所述多个嵌合凹部被排列成并排排列，间隔开，空气通道在多个嵌合凹部之间上下循环空气， 定位在壳体中并与空气通道连通，排气出口定位在与空气路径连通并且位于所述入口上方的壳体中，并且发热部件位于空气路径中。
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公开(公告)号：US07090394B2
公开(公告)日：2006-08-15
申请号：US10605519
申请日：2003-10-06
IPC分类号： G01K7/00
CPC分类号： G01K1/08
摘要： Temperature gauge, and ceramic susceptors and semiconductor manufacturing equipment utilizing the temperature gauge, in which the thermocouple may be easily replaced even if damaged, and in which heat from the temperature-gauging site is readily transmitted to the temperature-gauging contact, shortening time until the measurement temperature stabilizes. A temperature-gauging contact (12) in the tip of the thermocouple contacts, in an exposed-as-it-is state, a temperature-gauging site on a ceramic susceptor (1), and by means of a circular cylindrical-shaped retaining member (11) screwed into female threads in the ceramic susceptor (1) is detachably pressed upon and retained against the ceramic susceptor. Thermocouple lead lines (13), passing through a through-hole (14) in the retaining member (11), stretch from one end face to the other end face thereof. The retaining member may be provided with a flange having threaded holes and screwlocked into female screws in the ceramic susceptor.
摘要翻译： 使用温度计的温度计和陶瓷感受体和半导体制造设备，其中热电偶即使损坏也可以容易地更换，并且来自温度测量部位的热量容易传递到温度测量接点，缩短时间直到 测量温度稳定。 热电偶尖端中的温度测量接点（12）以暴露状态接触陶瓷基座（1）上的温度测量位置，并且通过圆柱形保持 螺纹连接在陶瓷基座（1）中的阴螺纹中的构件（11）可拆卸地按压并保持在陶瓷基座上。 穿过保持构件（11）中的通孔（14）的热电偶引线（13）从一个端面延伸到另一端面。 保持构件可以设置有具有螺纹孔的凸缘并且被螺纹锁定在陶瓷基座中的内螺纹中。
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公开(公告)号：US20100134975A1
公开(公告)日：2010-06-03
申请号：US12452612
申请日：2008-07-25
申请人： Tatsuya Shimizu , Manabu Hashikura
发明人： Tatsuya Shimizu , Manabu Hashikura
IPC分类号： H05K7/20
CPC分类号： H02G3/03 , H05K7/20127 , H05K7/202
摘要： In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.
摘要翻译： 在电连接箱中，隔热壁在壳体中垂直延伸。 这形成在隔热壁和壳体的内壁之间，空气可以上升的上升流路和空气可以下降的下降流路。 在隔热壁的上端和下端分别设置有连通上升流路和下降流路的上连通开口和下连通开口。 继电器放置在上升流路中。 在这种情况的区域中，形成下降流路的区域设置有用于将下降流路中的空气的热量释放到壳体的外部的散热壁部。
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公开(公告)号：US07616438B2
公开(公告)日：2009-11-10
申请号：US11984083
申请日：2007-11-13
IPC分类号： H05K7/20
摘要： An electric connection box according to one aspect of the present invention can include conductive members on a circuit board, a case accommodating the circuit board, a ventilation path formed in the case and through which air can flow in a vertical direction, a suction port formed in the case to be in communication with the ventilation path, an exhaust port formed in the case to be in communication with the ventilation path, the exhaust port positioned above the suction port, cooled portions positioned on the conductive members and positioned in the ventilation path so as to allow air to flow in the vertical direction between conductive members, and heat generating components connected to the cooled portions of the conductive members.
摘要翻译： 根据本发明的一个方面的电连接盒可以包括电路板上的导电构件，容纳电路板的壳体，形成在壳体中的通气路径，空气可以沿垂直方向流动，形成吸入口 在与通气路径连通的情况下，形成在壳体中与通气路径连通的排气口，位于吸入口上方的排气口，位于导电构件上并位于通气路径中的冷却部分 使得空气在导电构件之间沿垂直方向流动，以及连接到导电构件的冷却部分的发热元件。
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19.发明授权Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed 有权用于半导体或液晶制造装置的保持器和其中安装有保持器的半导体或液晶制造装置公开(公告)号：US07414823B2
公开(公告)日：2008-08-19
申请号：US10709889
申请日：2004-06-03
IPC分类号： H01L21/683 , H02N13/00
CPC分类号： H01L21/68757 , C23C16/4581 , C23C16/4586 , H01L21/68785 , H05B3/12 , H05B3/143
摘要： Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.
摘要翻译： 提供用于半导体或液晶制造装置的保持器以及其中安装保持器的半导体或液晶制造装置，其中加工对象保持面的温度均匀性提高。 配置陶瓷基座上的支架，陶瓷和金属的复合材料，可提高保持器的加工对象保持面的温度均匀性，并减少微粒和其他污染物的产生。 另外，至少在保持面上涂上涂层，提高了保持体的耐久性。 在半导体制造装置或液晶制造装置中安装这样的支架有助于制造生产率和生产率优异的半导体或液晶制造装置。
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公开(公告)号：US07408131B2
公开(公告)日：2008-08-05
申请号：US11551726
申请日：2006-10-23
CPC分类号： H01L21/68757 , H01L21/67103 , H01L21/67248
摘要： A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).
摘要翻译： 提供了一种晶片保持器，其中支撑和加热晶片中的局部热辐射保持在控制之下，并且晶片保持表面的温度均匀性得到增强，并且通过利用晶片保持器，适于处理较大直径晶片的半导体制造装置为 提供。 在陶瓷基板（2）内具有电阻加热元件（3）等并配有穿过反应室（6）的引线（4）的晶片保持器（1）中，引线（4）容纳在 管状引导构件（5）以及引导构件（5）和反应室（6）之间的间隔以及引导构件（5）的内部被气密地密封。 引导构件（5）和陶瓷基板（2）不接合在一起，并且在内部被密封的引导构件（5）的内部，朝向陶瓷基板（2）的气氛优选为 与反应室（6）中的气氛相同。
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