公开(公告)号：US20140220795A1

公开(公告)日：2014-08-07

申请号：US14103085

申请日：2013-12-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lei Bai ,  Xiongbiao Liu ,  Lexiong Peng

IPC: H01R12/73

CPC classification number: H01R12/737 ,  H05K1/14 ,  H05K1/144 ,  H05K7/1445 ,  H05K2201/10189

Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.

Abstract translation: 本发明公开了一种电路板互连架构，其包括至少一个第一插板和至少两个基本上垂直于第一插板的第二插板，其中第一插板和第二插板中的至少一个设置有多个插槽; 第一插板和第二插板通过使用插槽两侧的信号连接器配合并电连接。 电路板互连架构解决了第一插板和第二插板在正交方向上的拟合精度问题。 即使在第一插板和第二插板之间存在组装公差，连接器仍然满足装配精度要求，这也可以避免在第一插板和第二插板相互连接之后第一电路板和第二电路板的整体变形 并正交配对。

公开(公告)号：US11720187B2

公开(公告)日：2023-08-08

申请号：US17827319

申请日：2022-05-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yingchun Zhang ,  Lei Bai ,  Junchao Luo ,  Teng Long

IPC: G06F3/0354 ,  G06F1/16

CPC classification number: G06F3/03547 ,  G06F1/169

Abstract: A touchpad assembly includes a baseplate, a support, and a balance bar. The baseplate includes a first plate body and a second plate body. The first plate body is higher than the second plate body in a thickness direction of the touchpad assembly, and the first plate body is configured to accommodate a battery of the electronic device. The support is disposed on a side of the baseplate, the balance bar is supported between the support and the baseplate, and is capable of rotating around a set fulcrum of the baseplate. The balance bar includes a main body portion and supporting portions. At least part of each of the supporting portions is located on the first plate body. An end of each of the supporting portions that extends away from the main body portion does not extend past a bottom surface of the first plate body in the thickness direction.

公开(公告)号：US20220291763A1

公开(公告)日：2022-09-15

申请号：US17827319

申请日：2022-05-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yingchun Zhang ,  Lei Bai ,  Junchao Luo ,  Teng Long

IPC: G06F3/0354 ,  G06F1/16

Abstract: A touchpad assembly includes a baseplate, a support, and a balance bar. The baseplate includes a first plate body and a second plate body. The first plate body is higher than the second plate body in a thickness direction of the touchpad assembly, and the first plate body is configured to accommodate a battery of the electronic device. The support is disposed on a side of the baseplate, the balance bar is supported between the support and the baseplate, and is capable of rotating around a set fulcrum of the baseplate The balance bar includes a main body portion and supporting portions. At least part of each of the supporting portions is located on the first plate body. An end of each of the supporting portions that extends away from the main body portion does not extend past a bottom surface of the first plate body in the thickness direction.

公开(公告)号：US11211212B2

公开(公告)日：2021-12-28

申请号：US15733784

申请日：2018-04-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weiyong Huang ,  Yaming Jiang ,  Lei Bai

IPC: H01H13/7065 ,  G06F3/02 ,  H01H13/83

Abstract: A keyboard includes a bottom plate, a circuit board disposed on the bottom plate, and a plurality of keys disposed on a side that is of the circuit board and that is away from the bottom plate. Each key includes a keycap, a rise-and-fall component connecting the keycap to the bottom plate, and an electronic ink screen fastened on a side that is of the keycap and that is away from the rise-and-fall component. A first electric conductor connected to the electronic ink screen is disposed on the keycap, a second electric conductor is disposed on the rise-and-fall component, and a third electric conductor is disposed on the bottom plate. A signal line used to supply power to the electronic ink screen is disposed on the circuit board.

公开(公告)号：US10161420B2

公开(公告)日：2018-12-25

申请号：US14938152

申请日：2015-11-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lei Bai ,  Lexiong Peng ,  Dong Wang

IPC: F04D25/12 ,  F04D29/66 ,  F04D25/06 ,  F04D29/52 ,  F04D29/68 ,  F04D19/00 ,  F04D29/32

Abstract: A fan, including a volute, a motor, and multiple fan blades that are assembled on a rotor of the motor, where the volute includes a side wall that is disposed around circumference of the multiple fan blades, and a support frame that is connected to an end of the side wall and located on an inner side of the side wall; and the rotor of the motor drives the multiple fan blades to rotate, where multiple through-holes are disposed on the side wall of the volute, and at least more than one of the multiple through-holes is a slant through-hole.

公开(公告)号：US09215831B2

公开(公告)日：2015-12-15

申请号：US14103504

申请日：2013-12-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingliang Hao ,  Yuan Dong ,  Lei Bai

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20554 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20563 ,  H05K7/20572 ,  H05K7/20736

Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.

Abstract translation: 散热系统技术领域本发明涉及散热系统。 所述散热系统包括：底盘，被配置为容纳正交结构的单板，其中所述单板包括垂直插入的板; 第一风扇组，安装在所述底盘的上前部的第一进气管内并构造成将空气引导到所述底盘中; 以及空气引导腔，其安装在所述底盘内并且构造成将由所述第一风扇组引导的空气输送到所述底盘中的所述垂直插入板上的部件以进行散热。 利用本发明的实施例中的散热系统，基于正交架构，将空气分别提供给通信系统设备中的垂直插入板上的散热部件。