公开(公告)号：US20230335081A1

公开(公告)日：2023-10-19

申请号：US18332868

申请日：2023-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weiwei Fan ,  Ming Chang ,  Hongli Wang ,  Xiaowen Cao ,  Wenhao Jiang ,  Siqing Du

IPC: G09G5/18 ,  G09G5/12

CPC classification number: G09G5/18 ,  G09G5/12 ,  G09G2310/08 ,  G09G2340/16

Abstract: A method includes: a processor that obtains several lines of data in to-be-displayed display data to generate a data block; generates a synchronization flag corresponding to the data block; encapsulates the data block and the synchronization flag corresponding to the data block to obtain a data packet corresponding to the data block; and sends all data packets corresponding to the display data to the display system. The display system sequentially parses all the data packets sent by the processor to obtain a synchronization flag associated with each data packet, and determines a display location of each data block on a display panel based on the synchronization flag to display the display data.

公开(公告)号：US11784417B2

公开(公告)日：2023-10-10

申请号：US17696100

申请日：2022-03-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang ,  Liangsheng Liu ,  Qizhang Hong

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q5/371 ,  H01Q1/00

CPC classification number: H01Q21/065 ,  H01Q1/002 ,  H01Q5/371 ,  H01Q9/0407

Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.

公开(公告)号：US11637381B2

公开(公告)日：2023-04-25

申请号：US17232798

申请日：2021-04-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang

IPC: H01Q13/18 ,  H01Q1/22 ,  H01Q13/02 ,  H01Q21/06 ,  H01L23/66 ,  H05K3/46

Abstract: In an antenna in package structure, a plurality of supporting blocks spaced apart from each other are disposed between a first substrate and a second substrate, and an antenna cavity is formed between every two adjacent supporting blocks. Therefore, a height of the supporting block determines a height of the antenna cavity. The supporting blocks spaced apart from each other are located between the first substrate and the second substrate, and at least one of the first substrate or the second substrate adheres to the supporting blocks spaced apart from each other using an adhesive layer.

公开(公告)号：US11489247B2

公开(公告)日：2022-11-01

申请号：US17150365

申请日：2021-01-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi Zhou ,  Ming Chang ,  Hailin Dong ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q5/35 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/04

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.