公开(公告)号：US11776820B2

公开(公告)日：2023-10-03

申请号：US17459919

申请日：2021-08-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaoyun Wei ,  Yong Yang ,  Chaojun Deng

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/11 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/11002 ,  H01L2224/11462 ,  H01L2224/73204

Abstract: Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.

公开(公告)号：US20230170622A1

公开(公告)日：2023-06-01

申请号：US18160181

申请日：2023-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhidong Zhao ,  Qiang Li ,  Dapeng Lao ,  Yong Yang

IPC: H01Q13/20 ,  H01Q9/04

CPC classification number: H01Q13/206 ,  H01Q9/0407

Abstract: This application provides a gap waveguide antenna structure and an electronic device, and relates to the field of communication radars. The antenna structure includes a top layer, a gap waveguide structure, a microstrip structure, and a bottom layer. The top layer is parallel to the bottom layer. A first metal layer and a second metal layer are laid on two sides of a dielectric layer of the top layer, and the microstrip structure is disposed on the second metal layer. A frame of the microstrip structure is separated from metal of the second metal layer by leaving a space. The foregoing special antenna structure can reduce a transmission loss, improve a coupling capability, and effectively improve transmission efficiency of energy or an electromagnetic wave.

公开(公告)号：US20220077912A1

公开(公告)日：2022-03-10

申请号：US17455527

申请日：2021-11-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yong Yang ,  Weixin Wang ,  Mingyang Sun

IPC: H04B7/06 ,  H04L5/00 ,  H04W16/28 ,  H04B17/336

Abstract: A method includes: determining M channel state information CSI beams, where interference noise power of a DMRS pilot signal carried on each of the M CSI beams is greater than a first preset value, interference noise power of an SRS pilot signal carried on each of the M CSI beams is greater than a second preset value, the M CSI beams are same-layer beams on a horizontal plane, the same-layer beams include N CSI beams, and M and N are positive integers; and if a ratio of M to N is greater than a third preset value, skipping scheduling and sending the N CSI beams included in the same-layer beams.