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公开(公告)号：US11862529B2
公开(公告)日：2024-01-02
申请号：US17473673
申请日：2021-09-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Xiaoyun Wei , Yong Yang , Jiye Xu , Xing Fu
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/367 , H01L23/498 , H01L23/00
CPC classification number: H01L23/367 , H01L23/49827 , H01L24/08 , H01L2224/05611 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05684 , H01L2224/08233
Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.
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2.发明公开公开(公告)号：US20230258890A1
公开(公告)日：2023-08-17
申请号：US18302011
申请日：2023-04-18
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xiaorui Liu , Chaojun Deng , Chunrong Li , Xiaoyu Tang
IPC: G02B6/42 , H01R43/18 , H01R13/506
CPC classification number: G02B6/4269 , G02B6/4284 , H01R13/506 , H01R43/18
Abstract: An optical cage assembly includes a box-like housing, a radiator, and a cover-like fastener. The box-like housing has a slot. A first housing wall of the box-like housing has an opening at a position close to a slot opening of the slot. The radiator is located at the opening and can be bonded to an electrical connector plugged into the slot. The cover-like fastener is fastened to housing walls of the box-like housing, and the cover-like fastener has a memory alloy member, where the memory alloy member is located on a surface that is of the radiator and that is away from the opening. In this disclosure, easy plugging and unplugging of an optical module in the slot can be implemented, heat transfer between the radiator and the optical module can be accelerated, and an effect of heat dissipation for the optical module can be enhanced.
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公开(公告)号：US20220344238A1
公开(公告)日：2022-10-27
申请号：US17862966
申请日：2022-07-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Chaojun Deng
IPC: H01L23/367 , H01L25/065 , H01L23/00 , H01L23/373
Abstract: A chip includes a housing, a plurality of silicon wafers, and a plurality of thermal pads. The plurality of silicon wafers and the plurality of thermal pads are mounted in the housing in a stacked manner. The thermal pad is mounted between two adjacent silicon wafers, and an edge of the thermal pad extends from a gap between the two adjacent silicon wafers. The thermal pad is mounted between the two adjacent silicon wafers.
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公开(公告)号：US20240085757A1
公开(公告)日：2024-03-14
申请号：US18507481
申请日：2023-11-13
Applicant: Huawei Technologies Co., Ltd.
Inventor： Chaojun Deng , Xiaoyun Wei , Yong Yang , Dajun Zang
CPC classification number: G02F1/292 , G02F1/2955
Abstract: An optical phased board includes a plurality of optical waveguide layers and a plurality of isolation layers. Each optical waveguide layer includes a plurality of optical waveguides, and the optical waveguides are arranged side by side. The optical waveguide layers and the isolation layers are arranged in a superimposed manner, and each isolation layer is located between two adjacent optical waveguide layers. The optical phased board includes a two-dimensional optical waveguide array to perform two-dimensional beam scanning.
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公开(公告)号：US11776820B2
公开(公告)日：2023-10-03
申请号：US17459919
申请日：2021-08-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xiaoyun Wei , Yong Yang , Chaojun Deng
IPC: H01L21/48 , H01L21/56 , H01L21/683 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/00
CPC classification number: H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/49827 , H01L24/11 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L24/73 , H01L2221/68345 , H01L2224/11002 , H01L2224/11462 , H01L2224/73204
Abstract: Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.
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Patent Agency Ranking
公开(公告)号：US11805592B2
公开(公告)日：2023-10-31
申请号：US17155324
申请日：2021-01-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Fei Ma , Wei Fang , Zhiwen Yang , Chungang Li , Shun Hao
CPC classification number: H05K1/0203 , G02B6/4269 , G02B6/4284 , H05K1/181 , H05K7/023 , H05K7/026 , H05K7/20409
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US11309967B2
公开(公告)日：2022-04-19
申请号：US16923383
申请日：2020-07-08
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Liankui Lin
IPC: H04B10/272 , H04Q11/00
Abstract: This application discloses a communications network and a related device. In one embodiment, the communications network includes a first optical line terminal and a second optical line terminal. The first optical line terminal is configured to send, through a first passive optical network (PON) interface based on a first PON protocol, a first optical signal to the at least one second optical line terminal. The second optical line terminal is configured to process the first optical signal and send through a second PON interface based on a second PON protocol, a processed first optical signal to at least one customer-premises equipment during downstream data transmissions, and process a second optical signal and send, through the first PON interface based on the first PON protocol, the processed second optical signal to the first optical line terminal during upstream data transmissions.
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公开(公告)号：US12058803B2
公开(公告)日：2024-08-06
申请号：US18372828
申请日：2023-09-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun Deng , Fei Ma , Wei Fang , Zhiwen Yang , Chungang Li , Shun Hao
CPC classification number: H05K1/0203 , G02B6/4269 , G02B6/4284 , H05K1/181 , H05K7/023 , H05K7/026 , H05K7/20409
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US10945068B2
公开(公告)日：2021-03-09
申请号：US16306768
申请日：2016-06-03
Applicant: Huawei Technologies Co., Ltd.
Inventor： Chaojun Deng , Liming Fang
Abstract: An ultrasonic wave-based voice signal transmission system, where the system includes an ultrasonic modulator, a beamforming controller, an ultrasonic transducer array, and a user detector. The ultrasonic modulator is configured to modulate a voice signal onto an ultrasonic band and output the modulated voice signal to the beamforming controller. The user detector is configured to detect a user and output a detection result of the user to the beamforming controller. The beamforming controller is configured to control according to the detection result from the user detector, a phase and amplitude of the modulated voice signal to obtain an electrical signal pointing to the user, and output, to the ultrasonic transducer array, the electrical signal pointing to the user. Therefore, call convenience can be improved for the user.
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公开(公告)号：US20190297416A1
公开(公告)日：2019-09-26
申请号：US16306768
申请日：2016-06-03
Applicant: Huawei Technologies Co., Ltd.
Inventor： Chaojun Deng , Liming Fang
Abstract: An ultrasonic wave-based voice signal transmission system, where the system includes an ultrasonic modulator, a beamforming controller, an ultrasonic transducer array, and a user detector. The ultrasonic modulator is configured to modulate a voice signal onto an ultrasonic band and output the modulated voice signal to the beamforming controller. The user detector is configured to detect a user and output a detection result of the user to the beamforming controller. The beamforming controller is configured to control according to the detection result from the user detector, a phase and amplitude of the modulated voice signal to obtain an electrical signal pointing to the user, and output, to the ultrasonic transducer array, the electrical signal pointing to the user. Therefore, call convenience can be improved for the user.
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