公开(公告)号：US20140318848A1

公开(公告)日：2014-10-30

申请号：US14327836

申请日：2014-07-10

Applicant: IBIDEN CO., LTD.

Inventor： Michimasa TAKAHASHI

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/142 ,  H05K1/115 ,  H05K3/10 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/2018 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A wiring board includes a wiring sub board having a conductive pattern, a board positioned alongside of the wiring sub board such that the board forms a boundary portion between the board and the wiring sub board, and an insulating layer made of an insulating material and continuously extending from the board to the wiring sub board such that the insulating layer is covering the boundary portion between the board and the wiring sub board. The boundary portion between the board and the wiring sub board is filled with the insulating material of the insulating layer such that the insulating material of the insulating layer is connecting the board and the wiring sub board.

Abstract translation: 布线基板包括具有导电图案的布线副板，位于布线副板旁边的板，使得板构成板和布线副板之间的边界部分，以及由绝缘材料制成的绝缘层，并且连续地 从板延伸到布线子板，使得绝缘层覆盖板和布线子板之间的边界部分。 板和布线子板之间的边界部分填充有绝缘层的绝缘材料，使得绝缘层的绝缘材料连接板和布线副板。