公开(公告)号：US20240251509A1

公开(公告)日：2024-07-25

申请号：US18624158

申请日：2024-04-02

Applicant: InnoLux Corporation

Inventor： Yu-Chia HUANG ,  Kuan-Feng Lee ,  Tsung-Han Tsai

IPC: H05K3/22 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K3/22 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/10 ,  H05K2203/1105

Abstract: A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, forming an opening in the transparent region after forming the electric circuit layer, wherein the opening penetrates through a portion of the electric circuit layer, and forming a filling layer on the flexible substrate after forming the opening, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.

公开(公告)号：US20240107664A1

公开(公告)日：2024-03-28

申请号：US18471070

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K3/0017 ,  H05K3/10

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

公开(公告)号：US11877390B2

公开(公告)日：2024-01-16

申请号：US17460421

申请日：2021-08-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John S. Werner ,  Jason T. Wertz ,  John Torok ,  Noah Singer ,  Arkadiy O. Tsfasman ,  Budy Notohardjono

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0275 ,  H05K3/10 ,  H05K2201/10151

Abstract: Methods of fabricating tamper-respondent sensors with random three-dimensional security patterns are provided. The methods include establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes determining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume which the security circuit is to fill in three dimensions. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern to fill the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor based on the established security circuit pattern.

公开(公告)号：US20230399533A1

公开(公告)日：2023-12-14

申请号：US18031882

申请日：2021-10-05

Applicant: DAEDONG CO., LTD.

Inventor： Seung Taeg LEE ,  Cheol Joo LEE ,  Hee Jung NOH ,  Gyeong Min KIM ,  Ji Yong LEE

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  H05K1/02 ,  H05K1/09 ,  H05K3/10

CPC classification number: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  H05K1/0296 ,  H05K1/092 ,  H05K3/10

Abstract: The present disclosure relates to a conductive aqueous ink composition for filling in an engraved micropattern, conductor-filled micropatterns fabricated using same, and a conductive device comprising same, wherein the conductive aqueous ink composition is conductive aqueous ink to be used for filling in an engraved micropattern formed on a substrate and can be applied to plastic bases, etc., and improve working environments due to low temperature sintering. The ink composition comprises: metal nanoparticles (A) protected by a dispersion stabilizer and ranging in particle size from 5 to 50 nm, metal particles (B) ranging in particle size from 100 to 900 nm; and a water-soluble solvent (C) having a boiling point of at least 150° C., the dispersion stabilizer containing a protective polymer composed of branched polyalkylene imine segments and polyoxyalkylene segments and an amine acid salt composed of an amine and an inorganic acid.

公开(公告)号：US20230345623A1

公开(公告)日：2023-10-26

申请号：US17726426

申请日：2022-04-21

Applicant: NXP B.V.

Inventor： Leo van Gemert ,  Michael B. Vincent

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K3/10 ,  H05K3/40 ,  H01P3/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56

CPC classification number: H05K1/0243 ,  H05K1/111 ,  H05K1/0218 ,  H05K3/3426 ,  H05K3/10 ,  H05K3/4007 ,  H01P3/121 ,  H01L24/16 ,  H01L23/3157 ,  H01L23/49838 ,  H01L23/66 ,  H01L21/4853 ,  H01L21/563 ,  H05K2201/10734 ,  H01L2224/16227 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2924/18161 ,  H01L2924/1903

Abstract: A packaging assembly and methodology provide a PCB substrate with one or more waveguide apertures and a conductive pattern which includes a plurality of landing pads that are disposed around peripheral edges of each waveguide aperture and that are connected to one another by trace lines so that, upon attachment and reflow of solder balls to the plurality of landing pads, the solder balls reflow along the trace lines to form a fully closed solder waveguide shielding wall disposed around peripheral edges of the first waveguide aperture.

公开(公告)号：US20230269885A1

公开(公告)日：2023-08-24

申请号：US18140769

申请日：2023-04-28

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Akitoshi SAKAUE

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K3/46 ,  H05K1/0298 ,  H05K3/10 ,  H05K2203/0502

Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

公开(公告)号：US20230254977A1

公开(公告)日：2023-08-10

申请号：US18301938

申请日：2023-04-17

Applicant: AT&S Austria Technologie & Systemtechnik AG

Inventor： Jonathan Silvano de Sousa ,  Erich Schlaffer

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/186 ,  H05K1/115 ,  H05K3/10 ,  H05K3/30 ,  H05K3/4038 ,  H05K2201/09509

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.

公开(公告)号：US20230250535A1

公开(公告)日：2023-08-10

申请号：US18119350

申请日：2023-03-09

Applicant: C3 Nano, Inc.

Inventor： Yongxing Hu ,  Xiqiang Yang ,  Ying-Syi Li ,  Alexander Seung-il Hong ,  Melanie Mariko Inouye ,  Yadong Cao ,  Ajay Virkar

IPC: C23C18/44 ,  C23C18/54 ,  C09D133/06 ,  C23C18/16 ,  B32B27/20 ,  B32B9/04 ,  B32B27/28 ,  B32B27/08 ,  B32B15/04 ,  B32B15/08 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D139/06 ,  C23C18/42 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  B32B15/01

CPC classification number: C23C18/44 ,  B32B9/045 ,  B32B15/04 ,  B32B15/08 ,  B32B15/018 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D133/06 ,  C09D139/06 ,  C23C18/42 ,  C23C18/54 ,  C23C18/1635 ,  C23C18/1637 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/097 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1283 ,  C09D105/08

Abstract: Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

公开(公告)号：US20230250307A1

公开(公告)日：2023-08-10

申请号：US18186210

申请日：2023-03-20

Applicant: FUJIFILM Corporation

Inventor： Yusuke Fujii ,  Kazuhiro Yokoi ,  Yohei Takahashi ,  Kohei Takeshita

IPC: C09D11/52 ,  C09D11/03 ,  B41M7/00 ,  H01B1/22 ,  H01B3/44 ,  H05K3/10

CPC classification number: C09D11/52 ,  B41M7/009 ,  C09D11/03 ,  H01B1/22 ,  H01B3/441 ,  H05K3/10

Abstract: Provided is an ink set containing an insulating ink that contains at least one polymerization initiator selected from the group consisting of an oxime compound, an alkylphenone compound, and a titanocene compound and a polymerizable monomer, and a conductive ink that contains at least one of a metal complex or a metal salt. Also provided are applications of the ink set.

公开(公告)号：US20230199972A1

公开(公告)日：2023-06-22

申请号：US17559290

申请日：2021-12-22

Applicant: MacDermid, Incorporated

Inventor： Christopher M. Larson ,  Kishore Viswanathan ,  Douglas M. Ceci

IPC: H05K3/38 ,  H05K1/09 ,  H05K1/02 ,  H05K1/05 ,  H05K3/10

CPC classification number: H05K3/385 ,  H05K1/05 ,  H05K1/09 ,  H05K1/0298 ,  H05K3/10 ,  H05K3/282 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;