公开(公告)号：US20200039820A1

公开(公告)日：2020-02-06

申请号：US16595532

申请日：2019-10-08

Applicant: Infineon Technologies AG

Inventor： Claus Waechter ,  Edward Fuergut ,  Bernd Goller ,  Michael Ledutke ,  Dominic Maier

IPC: B81C1/00 ,  B81B7/00

Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

公开(公告)号：US10435292B2

公开(公告)日：2019-10-08

申请号：US15651522

申请日：2017-07-17

Applicant: Infineon Technologies AG

Inventor： Claus Waechter ,  Edward Fuergut ,  Bernd Goller ,  Michael Ledutke ,  Dominic Maier

IPC: H01L27/14 ,  B81C1/00 ,  B81B7/00

Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

公开(公告)号：US20170263480A1

公开(公告)日：2017-09-14

申请号：US15607735

申请日：2017-05-30

Applicant: Infineon Technologies AG

Inventor： Michael Ledutke ,  Edward Fuergut

IPC: H01L21/673 ,  H01L23/31 ,  H01L21/56 ,  H01L21/66

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/67336 ,  H01L22/10 ,  H01L22/32 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In various embodiments, an arrangement is provided. The arrangement may include a plurality of chips; a chip carrier carrying the plurality of chips, the chip carrier including a chip carrier notch; and encapsulation material encapsulating the chip carrier and filling the chip carrier notch; wherein the outer circumference of the encapsulation material is free from a recess.

公开(公告)号：US20140306356A1

公开(公告)日：2014-10-16

申请号：US13860679

申请日：2013-04-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Michael Ledutke ,  Edward Fuergut

IPC: H01L23/31 ,  H01L21/66

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L21/67336 ,  H01L22/10 ,  H01L22/32 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In various embodiments, an arrangement is provided. The arrangement may include a plurality of chips; a chip carrier carrying the plurality of chips, the chip carrier including a chip carrier notch; and encapsulation material encapsulating the chip carrier and filling the chip carrier notch; wherein the outer circumference of the encapsulation material is free from a recess.

Abstract translation: 在各种实施例中，提供了一种布置。 该布置可以包括多个芯片; 承载所述多个芯片的芯片载体，所述芯片载体包括芯片载体缺口; 以及封装芯片载体并填充芯片载体凹口的封装材料; 其中所述封装材料的外周没有凹部。