公开(公告)号：US11062970B2

公开(公告)日：2021-07-13

申请号：US15689463

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Syadwad Jain ,  Nachiket R. Raravikar

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.

公开(公告)号：US20170287664A1

公开(公告)日：2017-10-05

申请号：US15089213

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  John J. Beatty

IPC: H01H37/46 ,  H01H37/04 ,  H01H37/64 ,  H01H37/72

CPC classification number: H01H37/46 ,  H01H37/00 ,  H01H37/04 ,  H01H37/48 ,  H01H37/52 ,  H01H37/64 ,  H01H37/72 ,  H01H2001/0078 ,  H01H2001/0084 ,  H01H2037/008

Abstract: Thermal switch technology is disclosed. In one example, a thermally activated switch can include an electronic substrate base, and first and second electrical contacts coupled to the electronic substrate base. The first and second electrical contacts can be movable relative to one another due to thermal expansion or contraction of a material to facilitate contact or separation of the first and second electrical contacts.