公开(公告)号：US20170176516A1

公开(公告)日：2017-06-22

申请号：US14976881

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Mohit Mamodia ,  Kyle Yazzie ,  Dingying David Xu ,  Kuang Liu ,  Paul J. Diglio ,  Pramod Malatkar

IPC: G01R31/28 ,  H05B3/26

CPC classification number: H05B3/267 ,  G01R31/2867 ,  G01R31/2875

Abstract: A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.