公开(公告)号：US20150243625A1

公开(公告)日：2015-08-27

申请号：US14708350

申请日：2015-05-11

Applicant: International Business Machines Corporation

Inventor： Sylvain Pharand

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/14505 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17505 ,  H01L2224/17515 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/32 ,  H01L2924/00012

Abstract: A method including forming a first solder bump on a chip, the first solder bump made of a first alloy, and forming a second solder bump on a chip, the second solder bump made of a second alloy, where the first alloy has a different alloy concentration and is different from the second alloy.

Abstract translation: 一种包括在芯片上形成第一焊料凸块的方法，由第一合金制成的第一焊料凸块，以及在芯片上形成第二焊料凸块，所述第二焊料凸块由第二合金制成，其中所述第一合金具有不同的合金 浓度不同于第二种合金。