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    Leveling system for 3D printer
    11.
    发明授权
    Leveling system for 3D printer 有权

    公开(公告)号：US10919224B2

    公开(公告)日：2021-02-16

    申请号：US16509121

    申请日：2019-07-11

    Applicant: IO Tech Group, Ltd.

    Inventor： Ziv Gilan ,  Daniel Liptz ,  Michael Zenou

    IPC: B29C64/245 ,  B29C64/268 ,  B29C64/379 ,  B33Y30/00 ,  B33Y40/00

    Abstract: A leveling system for a 3D printing system for laser dispensing includes inner and outer frames, each supported at its corners by respective actuators of first and second sets of actuators. The outer frame supports an optical plane within which material to be dispensed by laser irradiation is disposed. The inner frame supports a receiving medium plane within which a substrate on which said material to be dispensed by laser irradiation is disposed. Each actuator operates independently to displace a respective frame corner in the vertical direction. The inner and outer frames each is attached at their respective corners to a respective actuator by a rod, thus allowing the inner and outer frames to freely rotate with respect to one another. An additional frame may support sensors for monitoring the 3D printing system.

    METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PRINTING
    13.
    发明申请
    METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PRINTING 审中-公开

    公开(公告)号：US20200350275A1

    公开(公告)日：2020-11-05

    申请号：US15929281

    申请日：2020-04-22

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: H01L23/00

    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

    MULTI-MATERIAL DISPENSING AND COATING SYSTEMS
    15.
    发明申请
    MULTI-MATERIAL DISPENSING AND COATING SYSTEMS 审中-公开

    公开(公告)号：US20200086341A1

    公开(公告)日：2020-03-19

    申请号：US16694616

    申请日：2019-11-25

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B05D1/26 ,  B05D1/40 ,  B05D7/00 ,  B05C11/02 ,  B05C11/10 ,  B05C5/02

    Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

    Methods for printing conformal materials on component edges at high resolution
    20.
    发明授权
    Methods for printing conformal materials on component edges at high resolution 有权

    公开(公告)号：US11497124B2

    公开(公告)日：2022-11-08

    申请号：US17302449

    申请日：2021-05-03

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou

    IPC: H05K3/28 ,  H05K3/00 ,  C23C14/34 ,  H05K3/12

    Abstract: Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

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