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    Method to electrically connect chip with top connectors using 3D printing
    2.
    发明授权
    Method to electrically connect chip with top connectors using 3D printing 有权

    公开(公告)号：US12046575B2

    公开(公告)日：2024-07-23

    申请号：US15929281

    申请日：2020-04-22

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: H05K3/00 ,  H01L23/00 ,  H05K3/12 ,  H05K3/32

    CPC classification number: H01L24/82 ,  H05K3/1283 ,  H05K3/32 ,  H01L2224/82051 ,  H01L2224/82103 ,  H01L2224/8284

    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

    Systems and methods for solder paste printing on components
    6.
    发明授权
    Systems and methods for solder paste printing on components 有权

    公开(公告)号：US11622451B2

    公开(公告)日：2023-04-04

    申请号：US17247981

    申请日：2021-01-04

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan ,  Michael Zenou

    IPC: H05K3/34 ,  H05K3/12

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

    Laser-based droplet array jetting of high viscous materials
    7.
    发明授权
    Laser-based droplet array jetting of high viscous materials 有权

    公开(公告)号：US11548212B2

    公开(公告)日：2023-01-10

    申请号：US17305747

    申请日：2021-07-14

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B41J2/14 ,  B05D3/06 ,  B29C64/268 ,  B29C64/112 ,  B29C64/205 ,  B41M5/00 ,  B33Y10/00 ,  B05D1/02

    Abstract: Laser jetting of droplets of a viscous material, such as an ink, is performed by coating a layer of ink on a mesh-like transport screen, with the ink being retained within spaces of the mesh-like transport screen. The ink-coated mesh-like transport screen is conveyed to a working area and a laser beam is used to heat the ink within the spaces of the mesh-like transport screen, thereby causing ink droplets to be jetted from the spaces of the mesh-like transport screen. Structures are formed on a receiving substrate arranged near the working area by jetting the ink droplets, either in an aggregation or sequentially, across a gap from the mesh-like transport screen to the receiving substrate and displacing the mesh-like transport screen and the laser beam relative to one another at times between the jetting of the droplets, or by directly printing ink droplets onto the receiving substrate.

    METHODS FOR ADDITIVE-ABLATIVE FABRICATION
    8.
    发明申请
    METHODS FOR ADDITIVE-ABLATIVE FABRICATION 有权

    公开(公告)号：US20220339885A1

    公开(公告)日：2022-10-27

    申请号：US17811998

    申请日：2022-07-12

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B29C64/393 ,  B29C64/40 ,  B29C64/106 ,  B29C64/118 ,  B29C64/112 ,  B29C64/165 ,  G05B19/4099 ,  B29C64/379 ,  B29C64/209 ,  B29C64/277 ,  B29C64/268 ,  B23K26/402

    Abstract: A method of solid free-form fabrication (SFF) includes receiving SFF data collectively pertaining to a three-dimensional shape of the object and comprising a plurality of slice data each defining a layer of the object. The method further includes dispensing a building material containing a solvent, drying the building material so as to remove at least some of the solvent from the building material and leveling the building material. The method further includes selectively ablating the building material, for at least several of the multiple layers, according to the slice data corresponding to the layer, and dispensing at least one additional building material onto the building material to fill vacant regions formed in the multiple layers by the selective ablation. A resolution of the dispensing of the additional building material may be less than a resolution of the selective ablation.

    Methods for negative 3D printing machine at high resolution
    10.
    发明授权
    Methods for negative 3D printing machine at high resolution 有权

    公开(公告)号：US11207830B2

    公开(公告)日：2021-12-28

    申请号：US17248220

    申请日：2021-01-14

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan ,  Michael Zenou ,  Guy Nesher

    IPC: B29C64/194 ,  B29C64/129 ,  B29C35/08 ,  B29C64/357 ,  B33Y30/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y40/20

    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.

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