公开(公告)号：US08760665B2

公开(公告)日：2014-06-24

申请号：US13203752

申请日：2010-01-26

Applicant: Ifeanyi Charles Ume ,  Tyler Randolph

Inventor： Ifeanyi Charles Ume ,  Tyler Randolph

IPC: G01B11/02

CPC classification number: G01N21/1702 ,  G01N2021/95638

Abstract: High speed autofocus interferometric inspection systems and methods are discussed in this Application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a system controller. The laser can produce laser pulses to excite a device such as a silicon wafer, chip capacitor or chip packaged/silicon die containing a plurality of solder bumps into vibration. The interferometer module can be disposed to receive reflected laser energy from the device to sense vibration displacements created in the device with the laser pulses. The system controller to receive vibration data from the interferometer, the system controller configured to output a control signal for adjusting a relative distance and position between the laser module and the device. Other aspects, features, and embodiments are also claimed and discussed.

Abstract translation: 本申请中讨论了高速自动对焦干涉检查系统和方法。 根据一些实施例，检查系统通常可以包括激光模块，干涉仪模块和系统控制器。 激光器可以产生激光脉冲以激发诸如硅晶片，芯片电容器或包含多个焊料凸块的芯片封装/硅晶片的器件振动。 干涉仪模块可以设置成从装置接收反射的激光能量，以用激光脉冲感测在装置中产生的振动位移。 所述系统控制器从所述干涉仪接收振动数据，所述系统控制器被配置为输出用于调整所述激光模块和所述装置之间的相对距离和位置的控制信号。 还要求和讨论其他方面，特征和实施例。

公开(公告)号：US08256296B2

公开(公告)日：2012-09-04

申请号：US12534296

申请日：2009-08-03

Applicant: Ifeanyi Charles Ume ,  Renfu Li ,  Matthew Rogge ,  Tsun-Yen Wu

Inventor： Ifeanyi Charles Ume ,  Renfu Li ,  Matthew Rogge ,  Tsun-Yen Wu

IPC: G01N29/00

CPC classification number: G01N29/449 ,  G01N29/11 ,  G01N2291/0258 ,  G01N2291/2675 ,  G01N2291/2694

Abstract: A method for processing ultrasonic response signals collected from a plurality of measurement locations along a weld to determine the presence of a defect in the weld may include filtering an ultrasonic response signal from each of the measurement locations to produce a filtered response signal for each of the measurement locations. Thereafter, an ultrasonic energy for each of the measurement locations is calculated with the corresponding filtered response signal. The ultrasonic energy for each measurement location is then compared to the ultrasonic energy of adjacent measurement locations to identify potential defect locations. When the ultrasonic energy of a measurement location is less than the ultrasonic energy of the adjacent measurement locations, the measurement location is a potential defect location. The presence of a defect in the weld is then determined by analyzing fluctuations in the ultrasonic energy at measurement locations neighboring the potential defect locations.

Abstract translation: 一种用于处理从沿着焊缝的多个测量位置收集的超声波响应信号以确定焊缝中缺陷的存在的方法可以包括从每个测量位置过滤超声波响应信号，以产生经过滤波的响应信号， 测量位置。 此后，用相应的滤波响应信号计算每个测量位置的超声波能量。 然后将每个测量位置的超声能量与相邻测量位置的超声能量进行比较，以识别潜在的缺陷位置。 当测量位置的超声能量小于相邻测量位置的超声波能量时，测量位置是潜在的缺陷位置。 然后通过分析与潜在缺陷位置相邻的测量位置处的超声能量的波动来确定焊缝中存在缺陷。

公开(公告)号：US20120111115A1

公开(公告)日：2012-05-10

申请号：US12942047

申请日：2010-11-09

Applicant: Ifeanyi Charles Ume ,  Abel Valdes ,  Jie Gong ,  Razid Ahmad

Inventor： Ifeanyi Charles Ume ,  Abel Valdes ,  Jie Gong ,  Razid Ahmad

IPC: G01N29/04

CPC classification number: G01N29/2418 ,  G01N29/4436 ,  G01N29/449 ,  G01N2291/267

Abstract: Non-contact microelectronic device inspection systems and methods are discussed and provided. Some embodiments include a method of generating a virtual reference device (or chip). This approach uses a statistics to find devices in a sample set that are most similar and then averages their time domain signals to generate the virtual reference. Signals associated with the virtual reference can then be correlated with time domain signals obtained from the packages under inspection to obtain a quality signature. Defective and non-defective devices are separated by estimating a beta distribution that fits a quality signature histogram of inspected packages and determining a cutoff threshold for an acceptable quality signature. Other aspects, features, and embodiments are also claimed and described.

Abstract translation: 讨论和提供非接触式微电子器件检查系统和方法。 一些实施例包括生成虚拟参考设备（或芯片）的方法。 该方法使用统计信息来查找最相似的样本集中的设备，然后对其时域信号进行平均以生成虚拟参考。 然后可以将与虚拟参考相关联的信号与从被检查的包获得的时域信号相关以获得质量签名。 通过估计匹配检查包的质量签名直方图的β分布并确定可接受的质量签名的截止阈值来分离有缺陷和无缺陷的设备。 还要求和描述其它方面，特征和实施例。

公开(公告)号：US20110023609A1

公开(公告)日：2011-02-03

申请号：US12534296

申请日：2009-08-03

Applicant: Ifeanyi Charles Ume ,  Renfu Li ,  Matthew Rogge ,  Tsun-Yen Wu

Inventor： Ifeanyi Charles Ume ,  Renfu Li ,  Matthew Rogge ,  Tsun-Yen Wu

IPC: G01N29/11

CPC classification number: G01N29/449 ,  G01N29/11 ,  G01N2291/0258 ,  G01N2291/2675 ,  G01N2291/2694

Abstract: A method for processing ultrasonic response signals collected from a plurality of measurement locations along a weld to determine the presence of a defect in the weld may include filtering an ultrasonic response signal from each of the measurement locations to produce a filtered response signal for each of the measurement locations. Thereafter, an ultrasonic energy for each of the measurement locations is calculated with the corresponding filtered response signal. The ultrasonic energy for each measurement location is then compared to the ultrasonic energy of adjacent measurement locations to identify potential defect locations. When the ultrasonic energy of a measurement location is less than the ultrasonic energy of the adjacent measurement locations, the measurement location is a potential defect location. The presence of a defect in the weld is then determined by analyzing fluctuations in the ultrasonic energy at measurement locations neighboring the potential defect locations.

Abstract translation: 一种用于处理从沿着焊缝的多个测量位置收集的超声波响应信号以确定焊缝中缺陷的存在的方法可以包括从每个测量位置过滤超声波响应信号，以产生经过滤波的响应信号， 测量位置。 此后，用相应的滤波响应信号计算每个测量位置的超声波能量。 然后将每个测量位置的超声能量与相邻测量位置的超声能量进行比较，以识别潜在的缺陷位置。 当测量位置的超声能量小于相邻测量位置的超声波能量时，测量位置是潜在的缺陷位置。 然后通过分析与潜在缺陷位置相邻的测量位置处的超声能量的波动来确定焊缝中存在缺陷。

公开(公告)号：US06564166B1

公开(公告)日：2003-05-13

申请号：US09611394

申请日：2000-07-07

Applicant: Ifeanyi Charles Ume ,  Gregory James Petriccione

Inventor： Ifeanyi Charles Ume ,  Gregory James Petriccione

IPC: G01K1700

CPC classification number: G01B11/25

Abstract: The projection moiré and temperature controlled chamber system houses a workpiece in the chamber and subjects the workpiece to changing temperatures according to a predefined temperature/time profile. As the workpiece is subjected to changing temperatures, a projection moiré system projects a plurality of moiré fringe patterns onto the workpiece, and a camera detects thermally induced warpage in the workpiece. The detection of thermally induced warpage, indicated by changes in the projected fringe moiré patterns on the workpiece, is analyzed by a processing unit. The temperature controlled chamber includes a plurality of heating sources, at least one cooling source, temperature probes and an adjustable support frame. Output temperature of the heating/cooling sources may be variable. The position of the support frame is adjustable and controlled by the processor in a manner such that a reference point associated with the workpiece or the frame is held in a stationery manner. The chamber may also include a plurality of air blowers and exhaust vents to facilitate temperature control within the chamber. An alternative embodiment includes a supplemental shadow moiré system.

Abstract translation: 投影云纹和温度控制室系统在室内容纳工件，并根据预定义的温度/时间曲线对工件进行变化的温度。 随着工件经受变化的温度，投影云纹系统将多个莫尔条纹图案投射到工件上，并且相机检测到工件中的热诱导翘曲。 通过处理单元分析由工件上投射的边缘莫尔图案的变化所指示的热诱导翘曲的检测。 温度控制室包括多个加热源，至少一个冷却源，温度探针和可调整的支撑框架。 加热/冷却源的输出温度可能是可变的。 支撑框架的位置可以由处理器调节和控制，使得与工件或框架相关联的参考点以文具方式保持。 腔室还可以包括多个鼓风机和排气口，以便于腔室内的温度控制。 替代实施例包括补充阴影莫尔系统。