公开(公告)号：US20240193617A1

公开(公告)日：2024-06-13

申请号：US18542370

申请日：2023-12-15

Applicant: Intel Corporation

Inventor： Francesc Guim Bernat ,  Karthik Kumar ,  Akhilesh S. Thyagaturu ,  Thijs Metsch ,  Adrian Hoban

IPC: G06Q30/018 ,  G06F9/50

CPC classification number: G06Q30/018 ,  G06F9/505

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed. An example apparatus includes programmable circuitry to at least: obtain a first response associated with an estimate of emissions to be produced by execution of a workload on first hardware; obtain a second response associated with an estimate of emissions to be produced by execution of the workload on second hardware; and assign one of the first or the second hardware to execute the workload based on the first response and the second response, the assigned one of the first or the second hardware to at least one of utilize more time or more memory to execute the workload than the other of the first or the second hardware.

公开(公告)号：US20230273659A1

公开(公告)日：2023-08-31

申请号：US18313993

申请日：2023-05-08

Applicant: Intel Corporation

Inventor： Francesc Guim Bernat ,  Kshitij Arun Doshi ,  Adrian Hoban ,  Thijs Metsch ,  John J. Browne

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/20281 ,  H05K7/20272

Abstract: Systems, apparatus, and methods for managing cooling of compute components are disclosed. An example apparatus includes programmable circuitry to at least one of instantiate or execute machine readable instructions to identify a workload to be performed by a compute device, identify a service level objective associated with the workload or the compute device, determine a parameter of a coolant to enable the service level objective to be satisfied during performance of the workload, and cause a cooling distribution unit to control the coolant based on the coolant parameter.

公开(公告)号：US20190042330A1

公开(公告)日：2019-02-07

申请号：US16023933

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Igor Duarte Cardoso ,  John OLoughlin ,  Louise Daly ,  Abdul Halim ,  Adrian Hoban

IPC: G06F9/50 ,  G06F1/32 ,  G06F1/20 ,  G06F9/455

Abstract: Methods, apparatus, systems, and articles of manufacture to manage heat in a CPU are disclosed. An example apparatus includes a metric collection agent to output a metric representative of a property of the central processor unit including a first core and a second physical core, the first physical core and the second physical core mapped to first and second logical cores by a map. A policy processor is to evaluate the first metric to determine whether to change the map to remap at least one of the first and second logical cores relative to the second one of the first and the second physical cores to move a process between the first and second physical cores to adjust the property, the moving of the process between the physical cores being transparent to an application/OS layer. A mapping controller is responsive to the policy processor to change the map.