公开(公告)号：US20220293882A1

公开(公告)日：2022-09-15

申请号：US17829036

申请日：2022-05-31

Applicant: Intel Corporation

Inventor： Praveen VISHAKANTAIAH ,  Zhiming J. ZHUANG ,  Hong W. WONG

IPC: H01L51/52 ,  F28D15/02

Abstract: An electronic device may include an organic light emitting display (OLED), a heat generating device, and a heat spreading device. The heat generating device may provide heat directly to the heat spreading device, and the heat spreading device is to dissipate the heat from the heat generating device and evenly heat the OLED and lower a driving voltage of the OLED to reduce power consumption of the OLED.

公开(公告)号：US20200303967A1

公开(公告)日：2020-09-24

申请号：US16085942

申请日：2016-07-21

Applicant: INTEL CORPORATION

Inventor： Hong W. WONG ,  Timothy NGUYEN ,  Shaorong ZHOU ,  Xiaoguo LIANG ,  Chia-Hung KUO

IPC: H02J50/80 ,  H02J50/05 ,  H02J50/10 ,  H02J50/90 ,  H02J7/00 ,  H01F38/14 ,  H02J7/02 ,  H05K7/20

Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.

公开(公告)号：US20180331318A1

公开(公告)日：2018-11-15

申请号：US15775374

申请日：2015-12-10

Applicant: INTEL CORPORATION

Inventor： Praveen VISHAKANTAIAH ,  Zhiming J. ZHUANG ,  Hong W. WONG

IPC: H01L51/52 ,  F28D15/02

CPC classification number: H01L51/529 ,  F28D15/02 ,  H01L27/32

Abstract: An electronic device may include an organic light emitting display (OLED), a heat generating device, and a heat spreading device. The heat generating device may provide heat directly to the heat spreading device, and the heat spreading device is to dissipate the heat from the heat generating device and evenly heat the OLED and lower a driving voltage of the OLED to reduce power consumption

公开(公告)号：US20160363970A1

公开(公告)日：2016-12-15

申请号：US15119017

申请日：2014-04-01

Applicant: Shaorong ZHOU ,  Hong W. WONG ,  INTEL CORPORATION

Inventor： Shaorong ZHOU ,  Hong W. WONG

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/20436

Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.

Abstract translation: 在一个示例中，公开了一种计算设备，其中处理元件和其它有源设备可以产生诸如计算设备的外壳上的热点之类的热不规则。 在某些情况下，这些热点可能从舒适性和可用性的观点来看是不希望的，或者因为它们可能导致对系统部件的热损伤。 为了补救包括热点在内的热不规则，可以在壳体或底盘中设置局部凹陷，以扩大热源与热点周围的底部壳体之间的气隙，使得热点处的底部壳体表面温度可以 随着气隙的增加而降低。 散热器也可以设置在局部凹陷上方以更好地在表面区域上分布热量。 在一些情况下，可以提供肋条以为布置在局部凹陷部上方的散热器提供结构支撑。