公开(公告)号：US20180351405A1

公开(公告)日：2018-12-06

申请号：US15779508

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Shaorong ZHOU ,  Songnan YANG ,  Hong W. WONG ,  Peipei DING ,  Xiaoguo LIANG ,  Ze An XIA

IPC: H02J50/12 ,  H02J7/00

CPC classification number: H02J50/12 ,  H02J7/025 ,  H02J2007/0062

Abstract: A universal power adapter may be provided to provide both a wireless charging signal and a DC signal for wired charging. The universal power adapter may include an AC/DC converter device, a first power circuit, a second power circuit, and a jack to provide a wireless charging signal and a DC signal. The AC/DC converter device to provide a DC signal based on an AC signal received from an external power source. The first power circuit to receive the DC signal and to provide a wireless charging signal based on the DC signal. The second power circuit to receive the DC signal and to provide a DC signal based on the DC signal. The jack may provide both the wireless charging signal and the DC signal.

公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20190296574A1

公开(公告)日：2019-09-26

申请号：US16305864

申请日：2016-06-30

Applicant: INTEL CORPORATION

Inventor： Hong W. WONG ,  Wah Yiu KWON ,  Shaorong ZHOU ,  Anand S. KONANUR ,  Songnan YANG

IPC: H02J7/02 ,  H02J50/10

Abstract: A computing system (100) with external wireless charging coil (150,550,650,750,850), includes a computing apparatus which includes a battery (120,210,320); and the external charging coil (150,550,650,750,850) to be coupled with the computing apparatus, including a self-coiling cable to transition to an uncoiled state when weighted and to transition to a coiled state when unweighted; wherein the battery (120,210,320) is chargeable by inductive charging utilizing the external charging coil (150,550,650,750,850) as an inductive receiving coil.

公开(公告)号：US20240314973A1

公开(公告)日：2024-09-19

申请号：US18671881

申请日：2024-05-22

Applicant: Intel Corporation

Inventor： Chen ZHANG ,  Xiang QUE ,  Yang YAO ,  Yuehong FAN ,  Guangying ZHANG ,  Liguang DU ,  Shaorong ZHOU ,  Chuanlou WANG ,  Yingqiong BU ,  Yue YANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20236 ,  H05K1/0203 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20409 ,  H05K7/20763 ,  H05K7/20263

Abstract: An apparatus is described that includes an immersion bath chamber and a cover that is to seal the immersion bath chamber. An apparatus is described that includes an immersion bath chamber and an installable/removable transfer member. The installable/removable transfer member has fluidic connectors designed to couple to respective warmed fluid flow output ports of pluggable units to be cooled in the immersion bath chamber and having respective backplane interface designs. An apparatus is described that includes an immersion bath chamber and an overflow chamber. The overflow chamber is to receive an overflow of liquid coolant from the immersion bath chamber, wherein a first exit flow channel from the overflow chamber is coupled to a second exit fluid flow channel from the immersion bath chamber through a valve, wherein, an opening of the valve is controllable to vary a gravitational fluid flow within the immersion bath chamber.

公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

公开(公告)号：US20200303967A1

公开(公告)日：2020-09-24

申请号：US16085942

申请日：2016-07-21

Applicant: INTEL CORPORATION

Inventor： Hong W. WONG ,  Timothy NGUYEN ,  Shaorong ZHOU ,  Xiaoguo LIANG ,  Chia-Hung KUO

IPC: H02J50/80 ,  H02J50/05 ,  H02J50/10 ,  H02J50/90 ,  H02J7/00 ,  H01F38/14 ,  H02J7/02 ,  H05K7/20

Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.

公开(公告)号：US20160363970A1

公开(公告)日：2016-12-15

申请号：US15119017

申请日：2014-04-01

Applicant: Shaorong ZHOU ,  Hong W. WONG ,  INTEL CORPORATION

Inventor： Shaorong ZHOU ,  Hong W. WONG

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/20436

Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.

Abstract translation: 在一个示例中，公开了一种计算设备，其中处理元件和其它有源设备可以产生诸如计算设备的外壳上的热点之类的热不规则。 在某些情况下，这些热点可能从舒适性和可用性的观点来看是不希望的，或者因为它们可能导致对系统部件的热损伤。 为了补救包括热点在内的热不规则，可以在壳体或底盘中设置局部凹陷，以扩大热源与热点周围的底部壳体之间的气隙，使得热点处的底部壳体表面温度可以 随着气隙的增加而降低。 散热器也可以设置在局部凹陷上方以更好地在表面区域上分布热量。 在一些情况下，可以提供肋条以为布置在局部凹陷部上方的散热器提供结构支撑。