公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.