公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.