公开(公告)号：US20240032248A1

公开(公告)日：2024-01-25

申请号：US18375056

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Sandeep AHUJA ,  Je-Young CHANG ,  Max KLEMES ,  Arpita MITRA

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20318 ,  H05K7/20809

Abstract: An apparatus is described. The apparatus includes a chamber to contain one or more electronic components, a first liquid and a second liquid. The electronics to be immersed in the second liquid. The first liquid having less density than the second liquid so that the first liquid floats above the second liquid. The first liquid to return second liquid molecules received from the second liquid back to the second liquid. The chamber comprising a first fluidic channel to drain the first liquid from the chamber while the second liquid is within the chamber.

公开(公告)号：US20220117079A1

公开(公告)日：2022-04-14

申请号：US17555250

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC: H05K7/20 ,  H01L23/367

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20240064931A1

公开(公告)日：2024-02-22

申请号：US18499112

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Jimmy CHUANG ,  Yuehong FAN ,  Jing-Hua HE ,  Sandeep AHUJA ,  Jay WU ,  Dongrui XUE ,  Xiaowei LI

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473

CPC classification number: H05K7/20263 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20236 ,  H05K7/20254 ,  H05K7/20763 ,  H05K7/20272

Abstract: An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.

公开(公告)号：US20220174843A1

公开(公告)日：2022-06-02

申请号：US17676100

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Sandeep AHUJA ,  Jeffory L. SMALLEY

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

公开(公告)号：US20210378099A1

公开(公告)日：2021-12-02

申请号：US17381092

申请日：2021-07-20

Applicant: Intel Corporation

Inventor： Phil GENG ,  Timothy Glen HANNA ,  Xiaoning YE ,  Sandeep AHUJA ,  Jacob MCMILLIAN ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY

IPC: H05K1/18 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20240008226A1

公开(公告)日：2024-01-04

申请号：US18238849

申请日：2023-08-28

Applicant: Intel Corporation

Inventor： Je-Young CHANG ,  Rajiv MONGIA ,  Sandeep AHUJA

IPC: H05K7/20

CPC classification number: H05K7/20381 ,  H05K7/20281 ,  H05K7/20272 ,  H05K7/20327 ,  H05K7/203 ,  H05K7/20236

Abstract: A method is described. The method includes repeatedly receiving information from one or more sensor circuits that are disposed within a coolant of an immersion cooling system, the one or more sensor circuits to detect one or more contaminants within the coolant. The method includes repeatedly processing the information. The method includes repeatedly keeping the one or more contaminants within acceptable levels within the coolant in response to the information by adjusting a valve setting that affects intake of the coolant to a filtration system of the immersion cooling system, and/or, adjusting a speed of a pump of the filtration system.

公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

公开(公告)号：US20220117080A1

公开(公告)日：2022-04-14

申请号：US17555340

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Casey WINKEL

IPC: H05K1/02 ,  H01L23/40 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.