公开(公告)号：US20210116391A1

公开(公告)日：2021-04-22

申请号：US17133563

申请日：2020-12-23

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Mark BIANCO ,  Victor POLYANKO

IPC分类号： G01N21/952 ,  H05K1/02 ,  H05K7/20

摘要： An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

公开(公告)号：US20200027808A1

公开(公告)日：2020-01-23

申请号：US16337883

申请日：2016-09-30

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tong W. CHAO ,  Stephanie L. SEAMAN ,  Ridvan A. SAHAN ,  Ying-Feng PANG

IPC分类号： H01L23/36 ,  H05K7/20 ,  H01L23/427

摘要： Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.