公开(公告)号：US20200229325A1

公开(公告)日：2020-07-16

申请号：US16336842

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Tong W. CHAO ,  Prabhakar SUBRAHMANYAM

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/40 ,  H02K11/33

Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.

公开(公告)号：US20200027808A1

公开(公告)日：2020-01-23

申请号：US16337883

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tong W. CHAO ,  Stephanie L. SEAMAN ,  Ridvan A. SAHAN ,  Ying-Feng PANG

IPC: H01L23/36 ,  H05K7/20 ,  H01L23/427

Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.