公开(公告)号：US20220077023A1

公开(公告)日：2022-03-10

申请号：US17525661

申请日：2021-11-12

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Ridvan A. SAHAN

IPC分类号： H01L23/38 ,  H01L23/42 ,  H01L23/00

摘要： An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.

公开(公告)号：US20220117112A1

公开(公告)日：2022-04-14

申请号：US17068333

申请日：2020-10-12

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Muhammad AHMAD

IPC分类号： H05K7/20 ,  H01L23/367

摘要： Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.

公开(公告)号：US20210351106A1

公开(公告)日：2021-11-11

申请号：US16871424

申请日：2020-05-11

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC分类号： H01L23/427 ,  G01R31/26 ,  B05B1/14

摘要： Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20210120703A1

公开(公告)日：2021-04-22

申请号：US17134368

申请日：2020-12-26

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Arun KRISHNAMOORTHY ,  Victor POLYANKO ,  Ying-Feng PANG ,  Yi XIA ,  Pooya TADAYON ,  Muhammad AHMAD ,  Rahima K. MOHAMMED

IPC分类号： H05K7/20

摘要： An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption

公开(公告)号：US20240244800A1

公开(公告)日：2024-07-18

申请号：US18290288

申请日：2021-09-24

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Pooya TADAYON ,  Yi XIA ,  Ying-Feng PANG ,  Mark BIANCO

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20336 ,  H05K7/2039

摘要： An apparatus is described. The apparatus includes a chip package cooling assembly chamber having one or more features to receive one or more heat pipes that receive heat generated by one or more semiconductor devices that reside outside the chip package. In detail, the heat pipes that are thermally coupled to the VR FET heat sinks are attached to the outside of the cold plate (again, they can be screwed to the cold plate with a thermal interface material between them). Thus, heat generated by the VR FETs is transferred to the VR FET heatsinks and the chip package cold plate via the heat pipes. The heat is then transferred to the fluid while it runs through the cold plate and is removed from the system by the fluid as it exits the outlet.

公开(公告)号：US20230420338A1

公开(公告)日：2023-12-28

申请号：US18034133

申请日：2021-03-06

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tong Wa CHAO ,  Ying-Feng PANG ,  Yi XIA ,  Rahima K. MOHAMMED ,  Victor P. POLYANKO ,  Ridvan A. SAHAN ,  Guangying ZHANG ,  Guoliang YING ,  Chuanlou WANG ,  Jun LU ,  Liguang DU ,  Peng WEI ,  Xiang QUE

IPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/367

CPC分类号： H01L23/473 ,  G06F1/206 ,  H01L23/3672 ,  G06F2200/201

摘要： Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

公开(公告)号：US20230260870A1

公开(公告)日：2023-08-17

申请号：US18137987

申请日：2023-04-21

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC分类号： H01L23/427 ,  B05B1/14 ,  G01R31/26

CPC分类号： H01L23/427 ,  B05B1/14 ,  G01R31/2642

摘要： Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20220196507A1

公开(公告)日：2022-06-23

申请号：US17133554

申请日：2020-12-23

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Victor POLYANKO ,  Mark BIANCO ,  Bijoyraj SAHU ,  Minh T.D. LE ,  Carlos ALVIZO FLORES ,  Javier AVALOS GARCIA ,  Adriana LOPEZ INIGUEZ ,  Luz Karine SANDOVAL GRANADOS ,  Michael BERKTOLD ,  Damion SEARLS ,  Jin YANG ,  David SHIA ,  Samer MELHEM ,  Jeffrey Ryan CONNER ,  Hemant DESAI ,  John RAATZ ,  Richard DISCHLER ,  Bergen ANDERSON ,  Eric W. BUDDRIUS ,  Kenan ARIK ,  Barrett M. FANEUF ,  Lianchang DU ,  Yuehong FAN ,  Shengzhen ZHANG ,  Yuyang XIA ,  Jun ZHANG ,  Yuan Li ,  Catharina BIBER ,  Kristin L. WELDON ,  Brendan T. PAVELEK

IPC分类号： G01M3/04 ,  G01M3/16 ,  G01M3/20 ,  H05K7/20

摘要： An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

公开(公告)号：US20240365513A1

公开(公告)日：2024-10-31

申请号：US18394503

申请日：2023-12-22

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Vishnu Prasadh SUGUMAR

IPC分类号： H05K7/20 ,  F25B5/02 ,  F25B49/02 ,  G06F1/20

CPC分类号： H05K7/20381 ,  F25B5/02 ,  F25B49/022 ,  G06F1/206 ,  H05K7/20309 ,  H05K7/20327 ,  F25B2700/191 ,  F25B2700/197 ,  F25B2700/2108 ,  F25B2700/21174 ,  F25B2700/21175

摘要： An apparatus and method for cooling a computing system, comprising a plurality of electronic components, with a cooling system. The cooling system includes a closed loop for the two-phase coolant, wherein the two-phase coolant has a saturation temperature. The closed loop includes a valve fluidly connected between an outlet of a heat exchanger and an inlet of a plurality of evaporator structures configured to be thermally coupled to the plurality of electronic components, and a compressor fluidly connected between an outlet of the plurality of evaporator structures and an inlet of the heat exchanger. The apparatus and method for the cooling system are configured to monitor one or more system temperatures of the computing system and adjust an operation of at least one of the valve or the compressor to alter the saturation temperature based on the one or more system temperatures.

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Tong Wa CHAO ,  Mark BIANCO ,  Yanbing SUN ,  Ming ZHANG ,  Guixiang TAN ,  Devdatta P. KULKARNI ,  Guocheng ZHANG ,  Hao ZHOU

IPC分类号： H05K7/20 ,  G11C5/04

摘要： A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.