公开(公告)号：US20240244800A1

公开(公告)日：2024-07-18

申请号：US18290288

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Pooya TADAYON ,  Yi XIA ,  Ying-Feng PANG ,  Mark BIANCO

IPC: H05K7/20

CPC classification number: H05K7/20809 ,  H05K7/20336 ,  H05K7/2039

Abstract: An apparatus is described. The apparatus includes a chip package cooling assembly chamber having one or more features to receive one or more heat pipes that receive heat generated by one or more semiconductor devices that reside outside the chip package. In detail, the heat pipes that are thermally coupled to the VR FET heat sinks are attached to the outside of the cold plate (again, they can be screwed to the cold plate with a thermal interface material between them). Thus, heat generated by the VR FETs is transferred to the VR FET heatsinks and the chip package cold plate via the heat pipes. The heat is then transferred to the fluid while it runs through the cold plate and is removed from the system by the fluid as it exits the outlet.

公开(公告)号：US20220196507A1

公开(公告)日：2022-06-23

申请号：US17133554

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Victor POLYANKO ,  Mark BIANCO ,  Bijoyraj SAHU ,  Minh T.D. LE ,  Carlos ALVIZO FLORES ,  Javier AVALOS GARCIA ,  Adriana LOPEZ INIGUEZ ,  Luz Karine SANDOVAL GRANADOS ,  Michael BERKTOLD ,  Damion SEARLS ,  Jin YANG ,  David SHIA ,  Samer MELHEM ,  Jeffrey Ryan CONNER ,  Hemant DESAI ,  John RAATZ ,  Richard DISCHLER ,  Bergen ANDERSON ,  Eric W. BUDDRIUS ,  Kenan ARIK ,  Barrett M. FANEUF ,  Lianchang DU ,  Yuehong FAN ,  Shengzhen ZHANG ,  Yuyang XIA ,  Jun ZHANG ,  Yuan Li ,  Catharina BIBER ,  Kristin L. WELDON ,  Brendan T. PAVELEK

IPC: G01M3/04 ,  G01M3/16 ,  G01M3/20 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Tong Wa CHAO ,  Mark BIANCO ,  Yanbing SUN ,  Ming ZHANG ,  Guixiang TAN ,  Devdatta P. KULKARNI ,  Guocheng ZHANG ,  Hao ZHOU

IPC: H05K7/20 ,  G11C5/04

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

公开(公告)号：US20210116391A1

公开(公告)日：2021-04-22

申请号：US17133563

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Mark BIANCO ,  Victor POLYANKO

IPC: G01N21/952 ,  H05K1/02 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.