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    HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE
    3.
    发明公开
    HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE 审中-公开

    公开(公告)号：US20240244800A1

    公开(公告)日：2024-07-18

    申请号：US18290288

    申请日：2021-09-24

    申请人： Intel Corporation

    发明人： Prabhakar SUBRAHMANYAM ,  Pooya TADAYON ,  Yi XIA ,  Ying-Feng PANG ,  Mark BIANCO

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  H05K7/20336 ,  H05K7/2039

    摘要： An apparatus is described. The apparatus includes a chip package cooling assembly chamber having one or more features to receive one or more heat pipes that receive heat generated by one or more semiconductor devices that reside outside the chip package. In detail, the heat pipes that are thermally coupled to the VR FET heat sinks are attached to the outside of the cold plate (again, they can be screwed to the cold plate with a thermal interface material between them). Thus, heat generated by the VR FETs is transferred to the VR FET heatsinks and the chip package cold plate via the heat pipes. The heat is then transferred to the fluid while it runs through the cold plate and is removed from the system by the fluid as it exits the outlet.

    OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECTRONIC SYSTEM
    9.
    发明申请
    OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECTRONIC SYSTEM 有权

    公开(公告)号：US20210116391A1

    公开(公告)日：2021-04-22

    申请号：US17133563

    申请日：2020-12-23

    申请人： Intel Corporation

    发明人： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Mark BIANCO ,  Victor POLYANKO

    IPC分类号： G01N21/952 ,  H05K1/02 ,  H05K7/20

    摘要： An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

    RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY
    10.
    发明申请
    RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY 审中-公开

    公开(公告)号：US20200027808A1

    公开(公告)日：2020-01-23

    申请号：US16337883

    申请日：2016-09-30

    申请人： Intel Corporation

    发明人： Prabhakar SUBRAHMANYAM ,  Tong W. CHAO ,  Stephanie L. SEAMAN ,  Ridvan A. SAHAN ,  Ying-Feng PANG

    IPC分类号： H01L23/36 ,  H05K7/20 ,  H01L23/427

    摘要： Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.