公开(公告)号：US12140489B2

公开(公告)日：2024-11-12

申请号：US17899395

申请日：2022-08-30

Applicant: InvenSense, Inc.

Inventor： Tsung Lin Tang ,  Chung-Hsien Lin ,  Ting-Yuan Liu ,  Weng Shen Su ,  Yaoching Wang

IPC: G01L9/12 ,  G01L9/00

Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.

公开(公告)号：US20230088319A1

公开(公告)日：2023-03-23

申请号：US17899395

申请日：2022-08-30

Applicant: InvenSense, Inc.

Inventor： Tsung Lin Tang ,  Chung-Hsien Lin ,  Ting-Yuan Liu ,  Weng Shen Su ,  Yaoching Wang

IPC: G01L9/00 ,  G01L9/12

Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.

公开(公告)号：US11490186B2

公开(公告)日：2022-11-01

申请号：US17211512

申请日：2021-03-24

Applicant: INVENSENSE, INC. ,  TDK Electronics AG

Inventor： Tsung Lin Tang ,  Chia-Yu Wu ,  Chung-Hsien Lin ,  Dennis Mortensen ,  Pirmin Rombach

IPC: H04R1/08

Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.

公开(公告)号：US20220070568A1

公开(公告)日：2022-03-03

申请号：US17211512

申请日：2021-03-24

Applicant: INVENSENSE, INC. ,  TDK Electronics AG

Inventor： Tsung Lin Tang ,  Chia-Yu Wu ,  Chung-Hsien Lin ,  Dennis Mortensen ,  Pirmin Rombach

IPC: H04R1/08

Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments