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公开(公告)号：US12180067B2
公开(公告)日：2024-12-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US10254185B2
公开(公告)日：2019-04-09
申请号：US15921504
申请日：2018-03-14
Applicant: InvenSense, Inc.
Inventor： Johannes Schumm , Andreas Reinhard , Thomas Kraehenbuehl , Stefan Thiele , Rene Hummel , Chung-Hsien Lin , Wang Shen Su , Tsung Lin Tang , Chia Min Lin
Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
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公开(公告)号：US10161817B2
公开(公告)日：2018-12-25
申请号：US14521918
申请日：2014-10-23
Applicant: InvenSense, Inc.
Inventor： Felix Mayer , Marc Von Waldkirch , Johannes Buhler , Rene Hummel , Stephan Braun , Marion Hermersdorf , Chung-Hsien Lin
Abstract: A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.
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公开(公告)号：US12140489B2
公开(公告)日：2024-11-12
申请号：US17899395
申请日：2022-08-30
Applicant: InvenSense, Inc.
Inventor： Tsung Lin Tang , Chung-Hsien Lin , Ting-Yuan Liu , Weng Shen Su , Yaoching Wang
Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
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公开(公告)号：US20230088319A1
公开(公告)日：2023-03-23
申请号：US17899395
申请日：2022-08-30
Applicant: InvenSense, Inc.
Inventor： Tsung Lin Tang , Chung-Hsien Lin , Ting-Yuan Liu , Weng Shen Su , Yaoching Wang
Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
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Patent Agency Ranking
公开(公告)号：US11499884B2
公开(公告)日：2022-11-15
申请号：US16518879
申请日：2019-07-22
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
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公开(公告)号：US11490186B2
公开(公告)日：2022-11-01
申请号：US17211512
申请日：2021-03-24
Applicant: INVENSENSE, INC. , TDK Electronics AG
Inventor： Tsung Lin Tang , Chia-Yu Wu , Chung-Hsien Lin , Dennis Mortensen , Pirmin Rombach
IPC: H04R1/08
Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.
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公开(公告)号：US20220098030A1
公开(公告)日：2022-03-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20220070568A1
公开(公告)日：2022-03-03
申请号：US17211512
申请日：2021-03-24
Applicant: INVENSENSE, INC. , TDK Electronics AG
Inventor： Tsung Lin Tang , Chia-Yu Wu , Chung-Hsien Lin , Dennis Mortensen , Pirmin Rombach
IPC: H04R1/08
Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments
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公开(公告)号：US20200087142A1
公开(公告)日：2020-03-19
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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