公开(公告)号：US5707962A

公开(公告)日：1998-01-13

申请号：US312091

申请日：1994-09-28

申请人： Charles C. Chen ,  Steven R. Jefferies

发明人： Charles C. Chen ,  Steven R. Jefferies

IPC分类号： A61K6/00 ,  A61K38/18 ,  A61L31/04 ,  A61L31/12 ,  A61L31/14 ,  A61L31/16 ,  A61K38/00 ,  A61F2/00 ,  C07K1/00

CPC分类号： A61L31/146 ,  A61K38/1841 ,  A61K38/1875 ,  A61K6/0205 ,  A61K6/033 ,  A61K6/087 ,  A61L31/044 ,  A61L31/047 ,  A61L31/127 ,  Y10S128/08 ,  Y10S514/801 ,  Y10S530/84

摘要： The present invention provides improved osteogenic compositions having enhanced by the sorption of growth factors, of nutrient factors, or drugs onto or into the compositions. Compositions may consist of collagen and demineralized bone materials onto and into which growth factors, antimicrobial agent, a nutrient factors, or other soluble factors may be sorbed to enhance the osteogenic factor. These materials can be used in a wide range of clinical procedures to replace and restore osseous or periodontal defects.

摘要翻译： 本发明提供通过生长因子，营养因子或药物吸附到组合物上或组合物中而增强的改善的成骨组合物。 组合物可以由胶原蛋白和去矿物质骨料组成，并且生长因子，抗微生物剂，营养因子或其它可溶性因子可被吸收以增强成骨因子。 这些材料可用于广泛的临床程序来替代和恢复骨质或牙周缺损。

公开(公告)号：US4655134A

公开(公告)日：1987-04-07

申请号：US756461

申请日：1985-07-18

申请人： Charles C. Chen

发明人： Charles C. Chen

IPC分类号： B41F17/36 ,  B41M1/30 ,  B41M3/00 ,  B41F17/00

CPC分类号： B41M3/00 ,  B41F17/36 ,  B41M1/305

摘要： A method for branding (labeling) a semiconductor chip package by warming the package prior to and subsequent to the branding resulting in a brand having greater clarity and permanency. A chip package is warmed to a temperature of about 95.degree. F. (35.degree. C.) to about 130.degree. F. (55.degree. C.) and an inked brand is applied to the warmed chip package. The branded chip package is maintained at a temperature of at least about 75.degree. F. (24.degree. C.) until the temperature is raised to a sufficient temperature to cure the branded chip package and then the branded chip package is cured.

摘要翻译： 一种通过在品牌之前和之后加热包装来标记（标记）半导体芯片封装的方法，从而导致品牌具有更高的清晰度和永久性。 将芯片封装加热至约95°F（35℃）至约130°F（55℃）的温度，并将着墨品牌应用于加热的芯片封装。 将品牌芯片封装保持在至少约75°F（24℃）的温度，直到温度升高至足够的温度以固化品牌芯片封装，然后固化该品牌芯片封装。