公开(公告)号：US5172214A

公开(公告)日：1992-12-15

申请号：US866282

申请日：1992-04-10

Applicant: James J. Casto

Inventor： James J. Casto

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H01L24/91 ,  H01L23/3107 ,  H01L23/49555 ,  H01L24/34 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49121

Abstract: A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.

Abstract translation: 具有薄封装形状的半导体器件是无引线的，从而最小化衬底上所需的安装空间。 在一种形式中，半导体器件具有电耦合到多个导电引线的半导体管芯。 每个引线具有分隔第一和第二部分的第一部分，第二部分和中间部分。 封装体封装半导体管芯和引线的第一和中间部分。 引线的第二部分暴露在封装主体的底表面上，并被用于电接入半导体管芯。

公开(公告)号：US5147821A

公开(公告)日：1992-09-15

申请号：US786205

申请日：1991-10-31

Applicant: Michael B. McShane ,  James J. Casto ,  Bennett A. Joiner

Inventor： Michael B. McShane ,  James J. Casto ,  Bennett A. Joiner

IPC: H01L21/56 ,  H01L23/433

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815

Abstract: A method for making a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounting surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has a plurality of leads which are electrically coupled to the semiconductor die. The semiconductor die and portions of the leads are encapsulated in a package body. Also incorporated into the package body is a heat sink. The heat sink has an opening which extends through the heat sink and exposes a portion of the mounting surface of the leadframe. The opening is used to apply a vacuum to the mounting surface during the formation of the package body so that the mounting surface and heat sink are held in close proximity. The closeness provides a good thermal conduction path from the semiconductor die to the ambient, thereby enhancing the thermal dissipation properties of the device.

Abstract translation: 提供一种制造具有散热器的半导体器件的方法，其中通过散热器的开口能够将真空源施加到半导体管芯安装表面。 在一种形式中，半导体管芯附接到引线框架的安装表面。 引线框架还具有电耦合到半导体管芯的多个引线。 半导体管芯和引线的部分被封装在封装主体中。 还包括在包装体内的是散热器。 散热器具有延伸穿过散热器并且暴露引线框的安装表面的一部分的开口。 开口用于在形成包装体期间向安装表面施加真空，使得安装表面和散热器保持紧密。 接近性提供了从半导体管芯到环境的良好的热传导路径，从而增强了器件的散热特性。

公开(公告)号：US5105259A

公开(公告)日：1992-04-14

申请号：US589465

申请日：1990-09-28

Applicant: Michael B. McShane ,  James J. Casto ,  Bennett A. Joiner

Inventor： Michael B. McShane ,  James J. Casto ,  Bennett A. Joiner

IPC: H01L21/56 ,  H01L23/433

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/1532 ,  H01L2924/181

Abstract: A semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounted surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has a plurality of leads which are electrically coupled to the semiconductor die. The semiconductor die and portions of the leads encapsulated in a package body. Also incorporated in the package body is a heat sink. The heat sink has an opening which extends through the heat sink and exposes a portion of the mounting surface of the leadframe. The opening is used to apply a vacuum to the mounting surface during the formation of the package body so that the mounting surface and heat sink are held in close proximity. The closeness provides a good thermal conduction path from the semiconductor die to the ambient, thereby enhancing the thermal dissipation properties of the device.

Abstract translation: 提供了具有散热器的半导体器件，其中通过散热器的开口能够将真空源施加到半导体管芯安装表面。 在一种形式中，半导体管芯附接到引线框架的安装表面。 引线框架还具有电耦合到半导体管芯的多个引线。 半导体管芯和封装在封装主体中的引线部分。 还包括在包装体中的是散热器。 散热器具有延伸穿过散热器并且暴露引线框的安装表面的一部分的开口。 开口用于在形成包装体期间向安装表面施加真空，使得安装表面和散热器保持紧密。 接近性提供了从半导体管芯到环境的良好的热传导路径，从而增强了器件的散热特性。