MANUFACTURING DEVICE OF DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE

    公开(公告)号:US20240284772A1

    公开(公告)日:2024-08-22

    申请号:US18427817

    申请日:2024-01-31

    Inventor: Masaru TAKAYAMA

    CPC classification number: H10K71/12 H10K59/1201 H10K59/122

    Abstract: According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate, forming an organic layer, forming an upper electrode, forming a first transparent layer, and forming a second transparent layer. In a deposition process, an evaporation source emits a material to the processing substrate and a film thickness measurement device, and the film thickness measurement device applies an acoustic impedance correction value which differs depending on a frequency of a crystal oscillator, and measures an evaporation rate based on an amount of change in the frequency of the crystal oscillator, and a controller controls the evaporation source such that the evaporation rate becomes constant.

    METHOD OF MANUFACTURING DISPLAY DEVICE
    12.
    发明公开

    公开(公告)号:US20240180016A1

    公开(公告)日:2024-05-30

    申请号:US18498051

    申请日:2023-10-31

    CPC classification number: H10K71/60 H10K71/233 H10K59/871

    Abstract: According to one embodiment, a method of manufacturing a display device, includes forming a lower electrode on a base including a first main surface and a side surface, the lower electrode being on the first main surface of the base, forming a rib including a pixel aperture, forming a partition on the rib, forming a first deposition film which includes a first organic layer which covers the lower electrode via the pixel aperture and a first upper electrode which covers the first organic layer and forming a first sealing layer which covers the first deposition film. The first sealing layer includes a first upper end portion which covers the first deposition film and a first side end portion which covers the side surface.

    DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE

    公开(公告)号:US20230309340A1

    公开(公告)日:2023-09-28

    申请号:US18186986

    申请日:2023-03-21

    Inventor: Masaru TAKAYAMA

    CPC classification number: H10K59/1201 H10K59/122 H10K59/873

    Abstract: According to one embodiment, a display device includes a lower electrode, a rib formed of an inorganic insulating material, a partition provided on the rib, an organic layer provided on the lower electrode, overlapping the rib, spaced apart from the partition and including a light emitting layer, a sealing layer formed of an inorganic insulating material, provided above the organic layer and being in contact with the partition, and an etching stopper layer provided between the rib and the sealing layer, and covering the rib between the organic layer and the partition. The etching stopper layer is formed of a material different from the sealing layer. An etching rate of the etching stopper layer is less than an etching rate of the sealing layer.

    DISPLAY DEVICE
    14.
    发明申请

    公开(公告)号:US20220223669A1

    公开(公告)日:2022-07-14

    申请号:US17645584

    申请日:2021-12-22

    Inventor: Masaru TAKAYAMA

    Abstract: According to one embodiment, a display device includes a second insulating layer having a first opening and a second opening, a partition disposed on the second insulating layer, a first organic layer, a first upper electrode. The partition includes a first layer formed of a metal material and including a first side surface and a second side, and a second layer including a bottom surface. The first upper electrode is in contact with the first side surface, the bottom surface extends from the first side surface toward the first opening and extends from the second side surface toward the second opening. A lower portion of the second layer has an inverted tapered shape whose width increases as it is closer to top from the bottom surface.

    MANUFACTURING METHOD AND MANUFACTURING EQUIPMENT OF DISPLAY DEVICE

    公开(公告)号:US20240414999A1

    公开(公告)日:2024-12-12

    申请号:US18677944

    申请日:2024-05-30

    Abstract: According to one embodiment, a manufacturing method includes preparing a substrate with a lower electrode, a rib and a partition, and forming an organic layer and an upper electrode. A first evaporation source used to form a first thin film of the organic layer includes a first nozzle emitting a material toward the substrate relatively moving. A second evaporation source used to form the upper electrode includes a second nozzle emitting a material toward the substrate relatively moving. An axis of at least one of the nozzles inclines to a direction orthogonal to a moving direction of the substrate with respect to a normal direction.

    MANUFACTURING DEVICE OF DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE

    公开(公告)号:US20240292728A1

    公开(公告)日:2024-08-29

    申请号:US18424968

    申请日:2024-01-29

    CPC classification number: H10K71/164

    Abstract: According to one embodiment, a manufacturing device includes a first evaporation chamber including first and second evaporation sources located between a first conveyance path and a second conveyance path for conveying a processing substrate. The first evaporation source is configured to emit a material to the first conveyance path. The second evaporation source is configured to emit a material to the second conveyance path. The manufacturing device further includes a first rotation chamber including a rotation mechanism which rotates while holding the processing substrate carried out of the first conveyance path of the first evaporation chamber, and configured to carry out the processing substrate to the second conveyance path of the first evaporation chamber.

    MANUFACTURING METHOD OF DISPLAY DEVICE AND EVAPORATION DEVICE

    公开(公告)号:US20230345806A1

    公开(公告)日:2023-10-26

    申请号:US18299085

    申请日:2023-04-12

    CPC classification number: H10K71/60 H10K71/10 C23C14/50

    Abstract: According to one embodiment, a processing substrate is prepared. An organic layer is formed. An etching stopper layer is formed. The forming the etching stopper layer includes, in a first mode, inclining an evaporation source, and depositing a material emitted from the evaporation source while relative positions of the evaporation source and the processing substrate are changed, and in a second mode, inclining the evaporation source in a manner different from the first mode, and depositing the material emitted from the evaporation source while the relative positions of the evaporation source and the processing substrate are changed in an opposite manner of the first mode.

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