Abstract:
According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate by forming a lower electrode, a rib and a partition, forming an organic layer on the lower electrode, forming an upper electrode on the organic layer, forming a first transparent layer on the upper electrode by depositing a first organic material, forming a second transparent layer on the first transparent layer by depositing a second organic material, and depositing the second organic material on each of a plurality of crystal oscillators included in a film thickness measurement device by emitting the second organic material from first and second nozzles of an evaporation source before forming the second transparent layer.
Abstract:
According to one embodiment, in a manufacturing method of a display device, a first etching stopper layer and a first sealing layer is formed. A second etching stopper layer and a second sealing layer is formed. A third etching stopper layer and a third sealing layer is formed. An etching rate of the first etching stopper layer is less than an etching rate of the first sealing layer. An etching rate of the second etching stopper layer is less than an etching rate of the second sealing layer. An etching rate of the third etching stopper layer is less than an etching rate of the third sealing layer. A thickness of each of the first etching stopper layer and the second etching stopper layer is greater than a thickness of the third etching stopper layer.
Abstract:
According to one embodiment, a display device includes a substrate, a lower electrode, a rib, a partition having lower and upper portions, an organic layer, and an upper electrode. The partition has first and second partitions. The upper portion of the first partition has a first end portion. The upper portion of the second partition has a second end portion. A thickness of the organic layer immediately under the first end portion is less than that of the organic layer immediately under the second end portion. A thickness of the upper electrode immediately under the first end portion is greater than that of the upper electrode immediately under the second end portion.
Abstract:
According to one embodiment, a manufacturing method of a display device includes forming processing substrate, forming an organic layer, forming an upper electrode, forming a transparent layer, and forming an inorganic layer. The forming the upper electrode includes inclining a first evaporation source with respect to a normal of the processing substrate and depositing a material emitted from the first evaporation source while conveying the processing substrate. The forming the inorganic layer includes inclining a second evaporation source to a side opposite to a side to which the first evaporation source is inclined and depositing a material emitted from the second evaporation source while conveying the processing substrate.
Abstract:
According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate by forming a lower electrode, forming an inorganic insulating layer, and forming a partition including a lower portion and an upper portion, forming an organic layer including a light emitting layer, forming an upper electrode, forming a cap layer, forming a first sealing layer, and forming a resin layer. The process of forming the organic layer, the upper electrode and the cap layer is an evaporation process using the partition as a mask in a vacuum environment. The process of forming the resin layer includes a process of applying a resinous material in an air atmosphere.
Abstract:
According to one embodiment, a method of manufacturing a display device, includes forming a lower electrode on a base including a first main surface and a side surface, the lower electrode being on the first main surface of the base, forming a rib including a pixel aperture, forming a partition on the rib, forming a first deposition film which includes a first organic layer which covers the lower electrode via the pixel aperture and a first upper electrode which covers the first organic layer and forming a first sealing layer which covers the first deposition film. The first sealing layer includes a first upper end portion which covers the first deposition film and a first side end portion which covers the side surface.
Abstract:
According to one embodiment, a display device includes a semiconductor layer, a first insulating film covering the semiconductor layer, a gate line extended in a first direction on the first insulating film to intersect the semiconductor layer, a second insulating film covering the gate line, a first common electrode formed on the second insulating film, a third insulating film covering the first common electrode, a source line which is extended in a second direction on the third insulating film and which is in contact with the semiconductor layer, and a fourth insulating film which covers the source line and which has a thickness greater than a thickness of the third insulating film.
Abstract:
According to one embodiment, a manufacturing device includes a main manufacturing line and a sub-line. The main manufacturing line includes a preprocessing portion, an in-line first evaporation device, a first CVD device for forming a first inorganic insulating layer of a sealing layer, a dry etching device for reducing a thickness of the first inorganic insulating layer, and a second CVD device for forming a second inorganic insulating layer of the sealing layer. The sub-line forms a detour which is different from the main manufacturing line as a conveyance path for conveying a processing substrate. The main manufacturing line and the sub-line form a loop conveyance path.
Abstract:
According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate, forming an organic layer, and forming an etching stopper layer on the organic layer. The forming the etching stopper layer includes carrying the processing substrate into a chamber, inside the chamber, emitting a material for forming the etching stopper layer from an evaporation source which inclines with respect to a normal of the processing substrate, and conveying the processing substrate while rotating the processing substrate in a plane orthogonal to the normal, and depositing the material emitted from the evaporation source on the processing substrate.
Abstract:
According to one embodiment, a method of manufacturing a display device, includes forming a first thin film including a first light-emitting layer over a first subpixel, a second subpixel, and a third subpixel, removing the first thin film of the second subpixel, forming a second thin film including a second light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, removing the second thin film of the first subpixel and the third subpixel, removing the first thin film of the third subpixel, forming a third thin film including a third light-emitting layer over the first subpixel, the second subpixel, and the third subpixel, and removing the third thin film of the first subpixel and the second subpixel.